D+

Program at a Glance

Final Program 다운로드

2022년 1월 13일(목)

1월 24일 (월)
Room A Room B Room C Room D
스페이드룸(6층) 에메랄드룸(5층) 사파이어룸(5층) 하트룸(6층)
10:30-13:00   Short Course 4-1
(글로벌세션-nano-KISS)

"Trends and Challenges in Nano-electronics"

13:00-14:00 점심 (그랜드볼룸, The Grill / 4층)*Short Course 4 참가자께만 제공
14:00-18:00 Short Course 1

"자율주행과 스마트카를 위한 센서
시스템 및 차량 네트워크 기술"

Short Course 2

"바이오메디컬 시스템반도체
연구 및 개발 사례"

Short Course 3

"차세대 파워반도체의 최신기술
- 파워 코리아"

Short Course 4-2
(글로벌세션-nano-KISS)

"Trends and Challenges in Nano-electronics"

1월 25일 (화) 5층 6층 5~6층
Room A Room B Room C Room D Room E Room F Room G Room H Room I Room J Room K Room L 로비
에메랄드
I
에메랄드
II+III
사파이어
I
사파이어
II+III
루비
II
스페이드
I
스페이드
II+III
하트
I
하트
II
하트
III
다이아몬드
I
다이아몬드
II
09:00-10:30 TA1-R TB1-S TC1-I TD1-K TE1-T TF1-G TG1-J TH1-E TI1-P TJ1-B TK1-F TL1-C 전시
(로비 / 5-6층)

포스터 세션1
(로비 / 5층)
*CDC 관람시간 (Core Session)
Storage Device Security & Application
(차세대 플래시 기반 스토리지 디바이스의 데이터 보안 및 응용)
Chip Design Contest Optimized MEMS & Sensor Structure Processing in Memory Artificial Intelligence I Thin Film Devices Neuromor-phic Electronics I Compound Semicon-
ductor I
Solar Energy Conversion Device Photo-
lithography
I
(포토리소
그래피 I)
Novel Device Characteri-
zation
Oxide Materials I
(산화물 I)
10:30-10:45 휴식
10:45-12:30 TA2-D TB2-D TC2-I TD2-K TE2-T TF2-G TG2-J TH2-E TI2-P TJ2-B TK2-F TL2-C
Memory Devices Area-selective Growth Sensing Module for Healthcare RRAM I Artificial Intelligence II Logic Devices and Reliability 2D Materials Compound Semicon-
ductor II
Solar Energy Conversion & Next Generation Battery Photo-
lithography II
(포토리소
그래피 II)
2D Device Technology 2D Materials
12:30-13:50 점심 (그랜드볼룸, The Grill / 4층)
13:50-14:00 개회식 (컨벤션홀 / 5층)
14:00-14:50 기조강연 1(컨벤션홀 / 5층)

"Memristive Neuromorphic Technology"

강성모 교수 (UC산타크루즈)
14:50-15:00 휴식
15:00-15:50 기조강연 2 (컨벤션홀 / 5층)

"인공지능과 반도체: 새로운 일상의 기반"

최기영 전 과기정통부장관 (서울대학교 (명예교수))
15:50-16:00 휴식
16:00-17:45 TA3-D TB3-D TC3-K TD3-K     TG3-J   TI3-P TJ3-B TK3-F TL3-C
Emerging Devices Thin Films Process I Ferroel-
ectric Memory
RRAM II     Functional Electronic Materials I   Mechanical & Heat Energy Conversion Devices Advanced Etch Processes Advanced Process Technology Post Si
17:45-18:00 휴식
18:00-20:00 만찬 (컨벤션홀 / 5층)
20:00-22:00 Rump Session 1

"Process in Memory (PIM)"

Room B (에메랄드 II+III)
Rump Session 2

"Semiconductor Industry in the Postpandemic Era"

Room D (사파이어 II+III)
 
1월 26일 (수) 5층 6층 5~6층
Room A Room B Room C Room D Room E Room F Room G Room H Room I Room J Room K Room L 로비
에메랄드
I
에메랄드
II+III
사파이어
I
사파이어
II+III
루비
II
스페이드
I
스페이드
II+III
하트
I
하트
II
하트
III
다이아몬드
I
다이아몬드
II
09:00-10:30 WA1-D WB1-D WC1-Q WD1-K WE1-U WF1-G WG1-J WH1-E WI1-M WJ1-H WK1-F WL1-C 전시
(로비 5-6층)

포스터 세션2
(로비 / 5층)
Thin Film Process II Two-dimensional Materials Metrology, Inspection, and Yield Enhance-
ment I
Artificial Neural Network Appli-
cations
Bio-
medical Circuits Design
(바이오-메디컬용 반도체 회로설계)
Memory Devices and Advanced Modeling Neuromor-phic Electronics II Compound Semicon-
ductor III
RF Circuits and Wireless Systems I Imaging Technology Photonic Device Technology Oxide Materials II
(산화물 II)
10:30-10:45 휴식
10:45-12:30 WA2-D WB2-D WC2-Q WD2-K WE2-U WF2-G WG2-J WH2-E WI2-M WJ2-H WK2-F WL2-C
Thin Film Process - Metallic Films Ferroel-
ectrics
Metrology, Inspection, and Yield Enhance-
ment II
Processing and Analysis of Emerging Memory Bio-
medical Semiconductor Application
(바이오-메디컬용 반도체
응용)
Ab-initio Simulation and Quantum Transport Functional Electronic Materials II Compound Semicon-
ductor IV
RF Circuits and Wireless Systems II Display Technology I Neuromor-phic Device Application Advanced Characteri-
zation
12:30-14:00 점심 (그랜드볼룸, The Grill / 4층)
14:00-15:30 WA3-D WB3-D WC3-Q WD3-K WE3-A WF3-O WG3-J WH3-L   WJ3-H WK3-F WL3-N
Device Fabrication Thin Film Transistors Metrology, Inspection, and Yield Enhance-
ment III
NAND Flash Memory Advanced Package Domain-Specific Circuits & Systems Nanoma-
terials
Analog Design I   Display Technology II Advanced Device Technology Traditional CAD Issues and Design Enhance-
ment
15:30-15:45 휴식
15:45-17:30     WC4-K WD4-K WE4-A WF4-O WG4-J WH4-L   WJ4-H WK4-F WL4-N
    RRAM III Charge Trap Flash and PRAM Emerging Intercon-
nect
VLSI Design for Signal Processing Van der Waals Heteros-
tructures
Analog Design II   Display Technology III 3D Integration Technology New Devices and Hardware with CAD
17:30-17:45 폐회식 (Room B(에메랄드 II+III) / 5층)
분과
A Interconnect & Package
B Patterning
C Material Growth & Characterization
D Thin Film Process Technology
E Compound Semiconductors
F Silicon and Group-IV Devices and Integration Technology
G Device & Process Modeling, Simulation and Reliability
H Display and Imaging Technologies
I MEMS & Sensor Systems
J Nano-Science & Technology
K Memory (Design & Process Technology)
L Analog Design
M RF and Wireless Design
N VLSI CAD
O System LSI Design
P Device for Energy (Solar Cell, Power Device, Battery, etc.)
Q Metrology, Inspection, and Yield Enhancement
R Semiconductor Software
S Chip Design Contest
T AI
U Bio-Medical
초청논문 30분
구두논문 15분
※ 구두발표 세션기호 보는 법
요일 세션룸 세션순서 분과
T 화요일 A Room A 1 첫번째 세션 A M
W 수요일 B Room B 2 두번째 세션 B N
    C Room C 3 세번째 세션 C O
    D Room D     D P
    E Room E     E Q
    F Room F     F R
    G Room G     G S
    H Room H     H T
    I Room I     I U
    J Room J     J  
    K Room K     K  
    L Room L     L  
※ TA1-R 화요일 Room A에서 첫타임에 진행되는 R분과의 세션
※ WB1-D-1: 수요일 Room B에서 첫타임에 진행되는 D분과 세션의 첫번째 발표
현장
포스터 발표
25일 A, B, C, D, E, F, G, H, I, S
26일 J, K, L, M, N, O, P, Q, R, T, U