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Home ÇÁ·Î±×·¥ > Program at a Glance
2¿ù 10ÀÏ(È­)
Time Room A Room B Room C Room D
104+105 107+108 116 117
14:00
-
17:00
180' Short Course 1 Short Course 2 Short Course 3 Short Course 4
2¿ù 11ÀÏ(¼ö)
Time Room A Room B Room C Room D Room E Room F Room G Room H Room I Room J Room K Room L
104 105 106 107 108 114+115 109 110 111 113 102+103 ·Îºñ
09:00
-
10:30
90'
[WA1-A]
TSV &
Micro-
bump
[WB1-B]
Patter-
ning
[WC1-G]
Device
modeling
and
simul-
ation
[WD1-N]
VLSI
Design &
Auto-
mation 
[WE1-E]
Material
charac-
teristic
¡¡
[WG1-O]
VLSI Systems
and
Appli-
cations
[WH1-I]
Physical
Sensor
System
[WI1-J]
¿¡³ÊÁö
CDC Chip
Design
Contest
Àü½Ã
10:30
-
10:40
10' ÈÞ½Ä (& Ä¿ÇÇ, ´Ù°ú)
10:40
-
12:00
100' ¡¡¡¡¡¡¡¡¡¡
[WP1]
Æ÷½ºÅÍ
¼¼¼Ç 1
¡¡
12:00
-
13:00
60' Á¡½É (& »óÀӿÀ§¿øȸ)
13:00
-
14:30
90'
[WA2-A]
Flip-chip,
Solar,
& LED
Package
[WB2-B]
Patter-
ning
[WC2-G]
Device
physics
and charac-
terization 1
[WD2-N]
System
Level
Design
& Test 
[WE2-E]
Device
&
Circuit
¡¡
[WG2-P]
Device
for
Energy
[WH2-I]
Chemical-
Bio
Sensor System
[WI2-J]
¸Þ¸ð¸®
¼ÒÀÚ,
³ª³ë
À¶ÇÕ/À¯¿¬
¼ÒÀÚ
CDC
14:30
-
14:40
10' ÈÞ½Ä (& Ä¿ÇÇ, ´Ù°ú)
14:40
-
16:00
100' ¡¡¡¡¡¡¡¡¡¡
[WP2]
Æ÷½ºÅÍ
¼¼¼Ç 2
¡¡
16:00
-
16:40
40' ±âÁ¶°­¿¬ 1 : Tesuo Endoh (Tohoku University, Japan)
¡°Future Memory Technology with Vertical MOSFET and STT-MRAM for Ultra Low Power Systems¡±
16:40
-
17:20
40' ±âÁ¶°­¿¬ 2 : Ȳ¼º¿ì Àü¹« (»ï¼ºÁ¾ÇÕ±â¼ú¿ø)
¡°Device Application Aspects of Graphene and Wafer Scale Growth of Single-Crystal Graphene on Germanium¡°
17:20
-
20:00
- ¹ÝµµÃ¼ÀÎÀÇ ¹ã (°³È¸½Ä & Reception)
2¿ù 12ÀÏ(¸ñ)
Time Room A Room B Room C Room D Room E Room F Room G Room H Room I Room J Room K Room L
104 105 106 107 108 114+115 109 110 111 113 102+103 ·Îºñ
09:00
-
10:30
90'
[TA1-A]
Emer-
ging
Inter-
connect
Techno-
logy
[TB1-H]
Display
and
Imaging
Techno-
logies
[TC1-G]
Device
varia-
bility
and reli-
ability 
[TD1-D]
Memory
Thin-
Film
Techno-
logies
[TE1-K]
RRAMs,
mem-
ristors,
and
MRAMs
¡¡
[TG1-F]
Emer-
ging
Devices
(1)
[TH1-C]
Growth
and
Charac-
teriza-
tion
of
Gra-
phene/
Nitrides
[TI1-J]
³ª³ë ±¸Á¶
9:30

10:30
[TJ1-R]
Semicon-
ductor Software 1
[TK1-M]
RF
Circuit
Blocks
and
Systems
Àü½Ã
10:30
-
12:10
100' ¡¡¡¡¡¡¡¡¡¡
[TP1]
Æ÷½ºÅÍ
¼¼¼Ç 3
¡¡
12:10
-
13:10
60' Á¡½É
13:10
-
14:40
90'
[TA2-A]
Barriers
for
CuInter-
con-
nect

[TB2-H]
Display
and
Imaging
Techno-
logies
[TC2-G]
Device physics
and
charac-
terization
2
[TD2-D]
Oxide Semicon-
ductor &
2D
Dichal-cogenide
Thin-
Film
Tran-
sistor Techno-
logies
[TE2-K]
PCRAMs,
SRAMs,
TFET
and
NEM
memories
¡¡
[TG2-F]
Emer-
ging
Devices
(2)
[TH2-C]
III-Vs
and
SiGe for
Elec-
tronic
Devices
[TI2-J]
Graphene & 2D
13:10

14:25
[TJ2-R]
Semicon-
ductor Software
II
[TK2-M]
CMOS
RF Device
and
Circuit
Solutions
14:40
-
14:50
10' ÈÞ½Ä (& Ä¿ÇÇ, ´Ù°ú)
14:50
-
16:20
90'
[TA3-A]
Con-
ductors, Con-
tacts
and
Low-k Dielec-
trics
[TB3-L]
Analog Design
[TC3-G]
RF and Terahertz
Devices
[TD3_D]
Device & Process
Thin
Film Techno-
logies
[TE3-K]
RRAM
and
FLASH
device,
modeling,
and
process
Techno-
logies
¡¡
[TG3-F]
Pro-
cesses and
test metho-
dologies for
scaled CMOS
[TH3-Q]
Metro-
logy,
Inspec-
tion,
and
Yield
Enhan
-cement
[TI3-J]
Graphene
& 2D
14:50
-
15:50
[TJ3-R]
Semicon-
ductor
Software
III
¡¡