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A. Interconnect & Package
| Interconnect |
- Metallization & Low-k Dielectrics
- Thin Film Deposition for Interconnect: ALD, Plating, Sputtering, PECVD, Spin-on Dielectrics, etc.
- Planarization Technology for Dielectrics and Metal
- Silicides, Contact, Barrier, Plug Materials
- Process Integration, Modeling, Simulation & Reliability for Interconnect
- 3D integration, TSV, Wafer Bonding
- Passive Component Integration and Characterization
- New Concept Interconnect (Optical, RF, Microwave,magnetic, etc.)
- Novel Interconnect Materials including CNT, Graphene, Nanowire, etc.
- Interconnect for Other Devices: Transparent Conducting Oxides, Roll-to-Roll
Processing,
Printing Process, etc
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| Packaging | - Electronic packaging materials & Processes
- Electronic packaging Design, Simulation & Reliability Test
- 3D and 2.5D packages
- Emerging Packaging TechnologiesShort Course
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B. Patterning
| Lithography | - Optical, EUV, E-Beam, Imprint Lithography
- Multiple Patterning
- Simulation and Optical Proximity Correction
- Design for Manufacturing
- Photoresist and Related Process
- Mask Technology
- Overlay control
- DSA(Directed Self-assembly)
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| Dry Etching | - Plasma & Surface Reactions
- Conductor & Si Etching
- Dielectric Etching
- Plasma Etching for Emerging Materials
- Plasma Etching for Advanced 3D Structures
- Plasma Diagnostics
- Modeling and Simulation
- Plasma Equipments
- New Dry Processes
- Advanced Process Control (APC)
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C. Materials Growth & Characterization
| | - Bulk Growth and Characterization (IV, III-V, II-VI Compound Semiconductors)
- Epitaxial Growth of Thin Film and Nano Structures (IV, IV-IV, III-V, II-VI Compound
Semiconductors)
- Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, III-V on Si etc.)
- Selective Epitaxy and Regrowth for Device Applications
- Growth of Nanostructures for Nitride and Oxide Semiconductors
- Bottom-up Growth of Nanohybrid Structures and Applications.
- New Characterization Methods for Materials and Devices
- Growth and Characterization of Carbon Related Materials
(Graphene, Graphite Oxide, CNT, etc.)
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D. Thin Film Process Technology
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- Advanced Gate Stack, Channel Process, and Integration Technology
- Novel Thin Film Processes
- Advanced DRAM Capacitor Materials and Devices
- New Memory Materials and Devices
- Thin Film Transistor (TFT) Process and Materials
- Thin Film Processes for Photovoltaics
- Sensors and Actuators Materials and Devices
- Compound Semiconductor Materials and Devices
- Organic Thin Films
- Carbonic or Dichalcogenide 2D Materials and Devices
- Low Temperature (<100
 ) Thin Film Deposition and Applications
- Thin Film Characterization Methodologies
- Thin Film Deposition and Treatment Apparatus for Mass Production
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E. Compound Semiconductors
| | - III-V Electronic and Optoelectronic Devices
- SiC, SiGe, and Other Compound Semiconductor Devices
- HBTs, HEMTs, and MISFETs
- LEDs, LDs, and Photodiodes
- RFICs, MMICs and HICs
- High Frequency and High Power Electronics
- Novel Devices and Materials
- New Process Technologies
- Backside Processing
- Manufacturing and Packaging
- Reliability, ESD, and Quality Issues
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F. Silicon Device and Integration Technology
| | - Novel CMOS and Post-CMOS Devices and Processes
- Analog/RF Devices and Processes
- High Voltage and Power Devices and Processes
- Novel Materials and Processes for CMOS Devices(e.g. Junction, Contact and Gate
Stack)
- Reliability Issues of CMOS and Post-CMOS Devices and Processes (e.g. HCI, BTI and
Self-Heating)
- Test Structures and Methodologies of CMOS and Post-CMOS Devices and Processes
- Device and Process Variations
- Device and Circuit Co-Optimization
- Si Electronics and Photonics Convergence
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G. Device & Process Modeling, Simulation and Reliability
| | - Process / Device Modeling and Simulation (Compact Modeling, Particle or
Continuum-level Process/Device Simulations, Atomistic Approaches for Growth,
Fabrication, and Transport Simulations, etc.)
- Modeling and Simulation for Novel Semiconductor Devices (FinFETs, Ultra-thin-
body MOSFETs,
III-V MOSFETs, Tunnel FETs, Spintronic FETs, and Carbon-based FETs,
Charge Trap Devices, etc.)
- Device Characterization, Variability and Yield (Device Model Parameter Extraction,
Random Dopant Fluctuation, Random Telegraph Noise, Yield Analysis, etc.)
- Reliabilty (Hot Carrier Effect, Time Dependent Dielectric Breakdown, Device
Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical
Overstress (EOS) and Electrostatic Discharge (ESD) effects, etc.)
- Semi-classical/Quantum Transport and Simulation of Nano-scale FET devices
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H. Display and Imaging Technologies
| | - Active Matrix Devices
- Liquid Crystal Technology
- Organic Light Emitting Displays
- LED and Lighting
- Flexible Displays
- Other Display Technologies
- Display Manufacturing and Equipment
- Thin Film Electronics
- Imaging Technologies
- Display and Imaging Device Driving Technology
- Circuits for Display and Imaging Device
- Display and Imaging Optics
- 3D Displays
- MEMS Displays
- Emerging Displays
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I. MEMS & Sensor Systems
| | - Macro/Meso/Micro/Nano/Quantum Sensors & Systems
- Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical
Sensors & Systems
- Smart/Intelligent/Integrated/Ubiquitos/IoT Sensor/Systems
- MEMS and Microsystems & Nanosystems
- Bio/Biomedical MEMS
- Micro Fluidics and Lab-on-a-Chip
- Optical and RF MEMS
- Power Microsystems
- Micro/NanoMaterials and Fabrications
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J. Nano-Science & Technology
| | - Graphene and Related Carbon Nanostructures
- Two-Dimensional Materials beyond Graphene
- Nanophotonic Materials and Devices
- Quantum Dot Photonics and Photovoltaics
- Soft Electronic/Photonic Materials and Devices
- Nanoscale Materials and Systems for Energy Conversion/Storage
- Quantum Transport Phenomena Related to Nanostructures
- Nanofabrication and Self-Assembly for Device Applications
- Spintronics: Materials and Devices
- Theoretical Transport Physics for Nanostructures
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K. Memory (Design & Process Technology)
| | - New Memory Cells / Device Concepts & Innovations
- Memory Process Technology Innovation and Advanced Processes
- Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs,
SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation
ROMs and Embedded Memories
- Emerging Memory Modeling / Design / Process / Device / Applications for MRAMs,
FeRAMs, PRAMs/PCRAMs, ReRAMs/RRAMs, Spin-Torque-Transfer Memories/Spin
Memories, NEMS,
Nano-Crystal, and FinFET, memristors, memristive devices, new
3D Memories, byte addressable persistent memories, etc
- Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques
like Redundancy, BIST, ECC and Statistical Design
- New memory technologies for bio-inspired applications such as neuromorphic ones
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L. Analog Design
| | - Analog Building Blocks
- Data Converters
- Power Circuits
- Display Driver ICs
- Image Sensors & Smart Sensors
- Clock Recovery & Generation
- Ultra Low Power Analog /Mixed-Signal Design Techniques
- Bio/Biomedical/mobile healthcare ICs
- Sensor Signal Conditioning Circuits
- MEMS analog circuits
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M. RF Design
| | - Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers
- Mixers, VCOs, and Frequency Synthesizers
- RF Transceiver ICs
- RF IC Design Techniques
- High-speed Serial Interface Circuits
- Millimeter-Wave ICs
- RF Photonics ICs and Systems
- RF Device Modeling
- Terahertz ICs
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N. VLSI CAD
| | - Hardware/software co-design
- Architecture, logic, physical synthesis
- Simulation/verification
- Deep submicron signal integrity
- Low power design methodology
- High performance design methodology
- Mixed-signal/RF design methodology
- Technology CAD
- Testing, Design for testability (DFT)
- GPU-based implementation of CAD algorithms
- Near threshold voltage design methods
- Other applications of CAD algorithms
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O. System LSI Design
| | - Processor/Multi-Core Architectures and Software
- Embedded Systems and Software
- Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
- High-Speed Low-Power Circuits and Systems
- Circuits and Systems for Communications
- Circuits and Systems for Digital Signal Processing / Visual Signal Processing
- Circuits and Systems for Storages (Memory Controller, eMMC, Solid-State Drive,
etc.)
- Circuits and Systems for Security
- Error Correction Coding Algorithm and Architectures
- Multimedia Algorithm and Architectures
- VLSI Systems and Applications
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P. Device for Energy
| | - Crystalline Silicon Solar Cells and Technologies
- PV Modules and System Components Including Testing and Reliability
- CIGS-II-VI and Related Thin Film Cell
- Amorphous and Nano/Microcrystalline Silicon Based Solar Cells and Related
Materials
- III-V Materials and Devices for Concentrator and Space PV Systems
- Photovoltaics with Nanocomposites and Other New Concepts
- PV Architecture and PV systems
- Power Devices (Si, Compound SC)
- Secondary Cells
- Cathod/Anode Materials
- Electrolytes and separators
- Interface phenomena
- Modeling and analysis
- Safety and reliability
- Cell design and evaluation
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Q. Metrology, Inspection, and Yield Enhancement
| | - Metrology and Inspection Methodologies
- Critical Dimension Metrologies
- Overlay, Registration, and Alignment Metrologies
- Process Control and Characterization
- Quality Assurance and Yield Enhancement
- Defect Detection, Analysis and Control
- Measurement System Modeling and Simulation
- Mask Related Metrology
- LCD / OLED Related Metrology
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R. Semiconductor Software
| | - Software architecture for new semiconductor technology
- Simulation and Emulation techniques for storage design
- Software for Fusion semiconductor
- File system and FTL (Flash Translation Layer)
- Storage Algorithms
- I/O Stack Analysis
- Virtualization for memory and storage
- Low power storage
- Bigdata issues on storage
- Memory management and Caching algorithms
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