모집분야

- Interconnect

• Metallization & Low-k Dielectrics
• Thin Film Deposition for Interconnect: ALD, Plating, Sputtering, PECVD, Spin-on Dielectrics, etc.
• Planarization Technology for Dielectrics and Metal
• Silicides, Contact, Barrier, Plug Materials
• Process Integration, Modeling, Simulation & Reliability for Interconnect
• Passive Component Integration and Characterization
• New Concept Interconnect (Optical, RF, Microwave,magnetic, etc.)
• Novel Interconnect Materials including CNT, Graphene, Nanowire, etc.
• Interconnect for Other Devices: Transparent Conducting Oxides, Roll-to-Roll Processing, Printing Process, etc

- Package

• Electronic packaging materials & Processes
• Electronic packaging Design, Simulation & Reliability Test
• 3D and 2.5D packages
• Emerging Packaging Technologies
• Test (wafer-level test, packaging-level test)

- Lithography

• Optical Lithography
• EUV Lithography
• Imprint Lithography
• Emerging Patterning Technologies
• Simulation and Optical Proximity Correction
• Photoresist and Related Process
• Design for Manufacturing
• Metrology and Inspection

- Dry Etching

• Plasma & Surface Reactions
• Plasma Etching for Si Devices
• Plasma Etching for Emerging Materials
• Plasma Etching for Advanced 3D Structures
• Plasma Processes for Ultrathin 2D Materials
• Plasma Diagnostics
• Modeling and Simulation
• New Plasma Equipments
• New Vapor Phase Processes

• Bulk and nano-structured Growth and Characterization (IV, III-V, II-VI Compound Semiconductors)
• Epitaxial Growth of Thin Film and Nano Structures (IV, IV-IV, III-V, II-VI Compound Semiconductors)
• Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, III-V on Si etc.)
• Selective Epitaxy and Regrowth for Device Applications
• Growth of Nanostructures for Nitride and Oxide Semiconductors
• Bottom-up Growth of Nanohybrid Structures and Applications.
• New Characterization Methods for Materials and Devices
• Growth and Characterization of Carbon Related Materials (Graphene, Graphite Oxide, CNT, etc.)

• Advanced Gate Stack, Channel Process, and Integration Technology
• Novel Thin Film Processes
• Advanced DRAM Capacitor Materials and Devices
• New Memory Materials and Devices
• Thin Film Transistor (TFT) Process and Materials
• Thin Film Processes for Photovoltaics
• Sensors and Actuators Materials and Devices
• Compound Semiconductor Materials and Devices
• Organic Thin Films
• Carbonic or Dichalcogenide 2D Materials and Devices
• Low Temperature(<100°C) Thin Film Deposition and Applications
• Thin Film Characterization Methodologies
• Thin Film Deposition and Treatment Apparatus for Mass Production

• III-V Electronic and Optoelectronic Devices
• SiGe, SiC, GaN and Other Compound Semiconductor Devices
• HBTs, HEMTs, and HFETs
• LEDs, LDs, and Photodiodes
• RFICs, MMICs and HICs
• High Frequency and High Power Electronics
• Novel Devices and Materials
• New Compound Semiconductor Process Technologies
• Metastable Surface Processing Technologies
• Backside Processing Technologies
• Compound Semiconductor Manufacturing and Packaging Technologies
• Reliability, ESD, and Quality Improving Technologies

• Novel CMOS Devices and Processes (e.g. FinFET, TFET, junctionless FET, NCFET, etc.)
• Novel Materials and Processes for Advanced CMOS Devices (e.g. SiGe, Ge, GeSn, channel, junction, gate stack, contact, etc.)
• Test Structures and Metrologies of CMOS Devices and Processes
• Reliability Issues in Devices and Processes (eg. HCI, BTI, self-heating, etc.)
• Management of Variations in Devices and Processes
• Si CMOS-Compatible Novel Synaptic Devices and Neuronic Circuitry 
• Si and Group-IV Photonic Devices and Electronics/Photonics Convergence
• 3D NAND Flash Memory and Array Architecture
• Novel Device and Circuit Co-Optimization
• Analog/RF Devices and Processes
• High-Voltage and Power Devices and Processes

• Device/Process Modeling and Simulation (Compact Modeling, Particle or Continuum-level Device/Process Simulations, Atomistic Approaches for Growth, Fabrication, Transport Simulations, etc.)
• Modeling and Simulation for Novel Semiconductor Devices (FinFETs, Ultra-Thin-Body MOSFETs, III-V MOSFETs, Tunnel FETs, Spintronic FETs, Carbon-based FETs, Charge Trap Devices, etc.)
• Device Characterization, Variability and Yield (Device Model-Parameter Extraction, Random DopantFluctuations, Random Telegraph Noise, Yield Analysis, etc.)
• Reliability (Hot Carrier Effect, Time-DependentDielectric Breakdown, Device Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical Overstress, Electrostatic Discharge (ESD) effects, etc.)
• Semi-Classical/Quantum Transport and Simulation of Nano-scale FET devices

• Active Matrix Devices
• Liquid Crystal Technology
• Organic Light Emitting Displays
• LED and Lighting
• Flexible Displays
• Display Manufacturing and Equipment
• Thin Film Electronics
• Imaging Technologies
• Display and Imaging Device Driving Technology
• Circuits for Display and Imaging Device
• Display and Imaging Optics
• 3D Displays
• MEMS Displays
• Touch Panel Technology
• Emerging Displays
• Quantum Devices
• Display and Imaging Device Application in IoT

• Macro/Meso/Micro/Nano/Quantum Sensors & Systems
• Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors & Systems
• Smart/Intelligent/Integrated/Ubiquitos/IoT Sensor/Systems
• MEMS and Microsystems & Nanosystems
• Bio/Biomedical MEMS
• Micro Fluidics and Lab-on-a-Chip
• Optical and RF MEMS
• Power Microsystems
• Micro/NanoMaterials and Fabrications

• Graphene and Related Carbon Nanostructures
• Two-Dimensional Materials beyond Graphene
• Nanophotonic Materials and Devices
• Quantum Dot Photonics and Photovoltaics
• Soft Electronic/Photonic Materials and Devices
• Nanoscale Materials and Systems for Energy Conversion/Storage
• Quantum Transport Phenomena Related to Nanostructures
• Nanofabrication and Self-Assembly for Device Applications
• Spintronics: Materials and Devices
• Theoretical Transport Physics for Nanostructures

• New Memory Cells / Device Concepts & Innovations
• Memory Process Technology Innovation and Advanced Processes
• Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories
• Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design
• New memory technologies for bio-inspired applications such as neuromorphic ones

• Analog Building Blocks
• Data Converters
• Power Circuits
• Energy Harvesting Circuits
• Display Driver ICs
• Image Sensors & Smart Sensors
• Clock Recovery & Generation
• Ultra Low Power Analog /Mixed-Signal Design Techniques
• Bio/Biomedical/mobile healthcare ICs
• Sensor Signal Conditioning Circuits
• MEMS analog circuits

• Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers
• Mixers, VCOs, and Frequency Synthesizers
• RF and Wireless Transceiver ICs
• RF IC Design Techniques
• High-speed Serial Interface Circuits
• Millimeter-Wave ICs
• RF Photonics ICs and Systems
• RF Device Modeling
• Terahertz ICs

• Hardware/software co-design
• Architecture, logic, physical synthesis
• Simulation and verification
• Deep submicron signal integrity
• Low-power/high-performance design methodology
• Mixed-signal/RF design methodology
• Neuromorphic system design methodology
•Technology CAD
• Testing, Design for testability (DFT)
• Acceleration of CAD algorithms
• Near-threshold voltage design methods
• Other applications of CAD algorithms
• Emerging technologies/applications

• Processor/Multi-Core Architectures and Software
• Embedded Systems and Software
• Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
• High-Speed Low-Power Circuits and Systems
• Circuits and Systems for Communications
• Circuits and Systems for Digital Signal Processing / Visual Signal Processing
• Circuits and Systems for Storages (Memory Controller, eMMC, Solid-State Drive, etc.)
• Circuits and Systems for Security/Hardware Security
• Circuits for Smart Automotive Systems
• Neural Networks and Neuromorphic Engineering
• Error Correction Coding Algorithm and Architectures
• Multimedia Algorithm and Architectures
• VLSI Systems and Applications

• Silicon Solar Cells and Technologies
• CIGS-II-VI and Related Thin Film Cells
• III-V Materials and Devices for Concentrator and Space PV Systems
• Photovoltaics with New Materials and Concepts
• PV Architecture and PV systems
• Power Devices (Si, Compound SC)
• Electrodes, electrolytes, separators and systems for energy storage (batteries, capacitors, fuel cells, etc.)
• Photocatalysts and photoelectrochemical systems for solar fuels
• Nanogenerators and self-powered systems
• Thermoelectrics

• Metrology and Inspection Methodologies (Device, Display, LED, Solar Cell, etc.)
• Critical Dimension and Mask Related Metrologies
• Overlay, Registration, and Alignment Metrologies
• Process Control and Characterization
• Defect Detection and Control
• Nanoanalysis with Structure, Surface, and Chemical Measurements
• Quality Assurance and Yield Enhancement
• Measurement System Modeling and Simulation

• Software architecture for new semiconductor technology
• Simulation and Emulation techniques for storage design
• Software for Fusion semiconductor
• File system and FTL (Flash Translation Layer)
• Storage Algorithms
• I/O Stack Analysis
• Virtualization for memory and storage
• Low power storage
• Bigdata issues on storage
• Memory management and Caching algorithms

• Chip implementation results from university (ASIC / FPGA)