모집분야 초록 작성 및 제출 안내 발표 안내 역대 초록 검색 게재 학술지

모집분야

- Interconnect
  • Metallization & Low-k Dielectrics
  • Thin Film Deposition for Interconnect: ALD, Plating, Sputtering, PECVD, Spin-on Dielectrics, etc.
  • Planarization Technology for Dielectrics and Metal
  • Silicides, Contact, Barrier, Plug Materials
  • Process Integration, Modeling, Simulation & Reliability for Interconnect
  • Passive Component Integration and Characterization
  • New Concept Interconnect (Optical, RF, Microwave,magnetic, etc.)
  • Novel Interconnect Materials including CNT, Graphene, Nanowire, etc.
  • Interconnect for Other Devices: Transparent Conducting Oxides, Roll-to-Roll Processing, Printing Process, etc
- Package
  • Electronic packaging materials & Processes
  • Electronic packaging Design, Simulation & Reliability Test
  • 3D and 2.5D packages
  • Emerging Packaging Technologies
  • Test (wafer-level test, packaging-level test)
  • Fan-out WLP/PLP
- Lithography
  • Optical Lithography
  • EUV Lithography
  • Imprint Lithography
  • Emerging Patterning Technologies
  • Simulation and Optical Proximity Correction
  • Photoresist and Related Process
  • Design for Manufacturing
  • Metrology and Inspection
- Dry Etching
  • Plasma & Surface Reactions
  • Plasma Etching for Si Devices
  • Plasma Etching for Emerging Materials
  • Plasma Etching for Advanced 3D Structures
  • Plasma Processes for Ultrathin 2D Materials
  • Plasma Diagnostics
  • Modeling and Simulation
  • New Plasma Equipments
  • New Vapor Phase Processes
  • Bulk and nano-structured Growth and Characterization (IV, III-V, II-VI Compound Semiconductors)
  • Epitaxial Growth of Thin Film and Nano Structures (IV, IV-IV, III-V, II-VI Compound Semiconductors)
  • Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, III-V on Si etc.)
  • Selective Epitaxy and Regrowth for Device Applications
  • Growth of Nanostructures for Nitride and Oxide Semiconductors
  • Bottom-up Growth of Nanohybrid Structures and Applications.
  • New Characterization Methods for Materials and Devices
  • Growth and Characterization of Carbon Related Materials (Graphene, Graphite Oxide, CNT, etc.)
  • 2DEG, Perovskite, Colloidal Quantum dot
  • Solar Cell Related Materials (Si, III-V CIGS, CdTe, etc)
  • Emerging Material for Electrical/Optical Devices
  • Wide Band-gap Material Synthesis (Diamond, Oxides, etc)
  • Design and Synthesis of Advanced Oxide Materials
  • 2D Materials Synthesis and Characterization
  • Advanced Gate Stack, Channel Process, and Integration Technology
  • Novel Thin Film Processes
  • Advanced DRAM Capacitor Materials and Devices
  • New Memory Materials and Devices
  • Thin Film Transistor (TFT) Process and Materials
  • Thin Film Processes for Photovoltaics
  • Sensors and Actuators Materials and Devices
  • Compound Semiconductor Materials and Devices
  • Organic Thin Films
  • Carbonic or Dichalcogenide 2D Materials and Devices
  • Low Temperature(<100°C) Thin Film Deposition and Applications
  • Thin Film Characterization Methodologies
  • Thin Film Deposition and Treatment Apparatus for Mass Production
  • III-V Electronic and Optoelectronic Devices
  • SiGe, SiC, GaN, Ga2O3 and Other Compound Semiconductor Devices
  • SBDs, HBTs, HEMTs, MOSFETs, and HFETs
  • LEDs, LDs, and Photodiodes
  • RFICs, MMICs and HICs
  • High Frequency and High Power Electronics
  • Novel Devices and Materials
  • New Compound Semiconductor Process Technologies
  • Metastable Surface Processing Technologies
  • Backside Processing Technologies
  • Compound Semiconductor Manufacturing and Packaging Technologies
  • Reliability, ESD, and Quality Improving Technologies
  • Novel CMOS Devices and Processes (e.g. FinFET, TFET, junctionless FET, NCFET, etc.)
  • Novel Materials and Processes for Advanced CMOS Devices (e.g. SiGe, Ge, GeSn, channel, junction, gate stack, contact, etc.)
  • Test Structures and Metrologies of CMOS Devices and Processes
  • Reliability Issues in Devices and Processes (eg. HCI, BTI, self-heating, etc.)
  • Management of Variations in Devices and Processes
  • Si CMOS-Compatible Novel Synaptic Devices and Neuronic Circuitry
  • Si and Group-IV Photonic Devices and Electronics/Photonics Convergence
  • 3D NAND Flash Memory and Array Architecture
  • Novel Device and Circuit Co-Optimization
  • Analog/RF Devices and Processes
  • High-Voltage and Power Devices and Processes
  • Device/Process Modeling and Simulation (Compact Modeling, Particle or Continuum-level Device/Process Simulations, Atomistic Approaches for Growth, Fabrication, Transport Simulations, etc.)
  • Modeling and Simulation for Novel Semiconductor Devices (FinFETs, Ultra-Thin-Body MOSFETs, III-V MOSFETs, Tunnel FETs, Spintronic FETs, Carbon-based FETs, Charge Trap Devices, etc.)
  • Device Characterization, Variability and Yield (Device Model-Parameter Extraction, Random Dopant Fluctuations, Random Telegraph Noise, Yield Analysis, etc.)
  • Reliability (Hot Carrier Effect, Time-Dependent Dielectric Breakdown, Device Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical Overstress, Electrostatic Discharge (ESD) effects, etc.)
  • Semi-Classical/Quantum Transport and Simulation of Nano-scale FET devices
  • Active Matrix Devices
  • Liquid Crystal Technology
  • Organic Light Emitting Displays
  • LED and Lighting
  • Flexible Displays
  • Display Manufacturing and Equipment
  • Thin Film Electronics
  • Imaging Technologies
  • Display and Imaging Device Driving Technology
  • Circuits for Display and Imaging Device
  • Display and Imaging Optics
  • 3D Displays
  • MEMS Displays
  • Touch Panel Technology
  • Emerging Displays
  • Quantum Devices
  • Display and Imaging Device Application in IoT
  • Macro/Meso/Micro/Nano/Quantum Sensors & Systems
  • Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors & Systems
  • Smart/Intelligent/Integrated/Ubiquitos/IoT Sensor/Systems
  • MEMS and Microsystems & Nanosystems
  • Bio/Biomedical MEMS
  • Brain-Computer/Neural Interfaces and Neural Devices
  • Micro Fluidics and Lab-on-a-Chip
  • Optical and RF MEMS
  • Power Microsystems
  • Micro/NanoMaterials and Fabrications
  • Graphene and Related Carbon Nanostructures
  • Two-Dimensional Materials beyond Graphene
  • Nanophotonic Materials and Devices
  • Quantum Dot Photonics and Photovoltaics
  • Soft Electronic/Photonic Materials and Devices
  • Nanoscale Materials and Systems for Energy Conversion/Storage
  • Quantum Transport Phenomena Related to Nanostructures
  • Nanofabrication and Self-Assembly for Device Applications
  • Spintronics: Materials and Devices
  • Theoretical Transport Physics for Nanostructures
  • New Memory Cells / Device Concepts & Innovations
  • Memory Process Technology Innovation and Advanced Processes
  • Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories
  • Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design
  • New memory technologies for emerging applications such as neuromorphic computing and logic-in-memory
  • Analog Building Blocks
  • Data Converters
  • Power Circuits
  • Energy Harvesting Circuits
  • Display Driver ICs
  • Image Sensors & Smart Sensors
  • Clock Recovery & Generation
  • Ultra Low Power Analog /Mixed-Signal Design Techniques
  • Bio/Biomedical/mobile healthcare ICs
  • Sensor Signal Conditioning Circuits
  • MEMS analog circuits
  • Front-end Circuits
  • Transmitter and Power Amplifiers
  • Oscillators and Frequency Synthesize
  • RF and Wireless Transceiver ICs
  • Low Power Transceiver & Wireless Connectivity IC
  • High-speed Serial Interface Circuits
  • Millimeter-Wave Circuits and Systems
  • Terahertz Circuits and System
  • RF Photonics Circuitsand Systems
  • RF Device Modeling, Packaging, and Testing
  • Emerging Circuit Technologies
  • Hardware/software co-design
  • Logic synthesis and optimization
  • Physical design (placement and routing)
  • Analysis, simulation and verification
  • Signal integrity analysis and optimization
  • Low-power and high-performance design
  • Mixed-signal/RF design methodology
  • Design methodology for neural networks
  • Testing, design for testability and manufacturability
  • CAD for emerging technologies and applications
  • Processor/Multi-Core Architectures and Software
  • Embedded Systems and Software
  • Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
  • High-Speed Low-Power Circuits and Systems
  • Circuits and Systems for Communications
  • Circuits and Systems for Digital Signal Processing / Visual Signal Processing
  • Circuits and Systems for Storages (Memory Controller, eMMC, Solid-State Drive, etc.)
  • Circuits and Systems for Security/Hardware Security
  • Circuits for Smart Automotive Systems
  • Neural Networks and Neuromorphic Engineering
  • Error Correction Coding Algorithm and Architectures
  • Multimedia Algorithm and Architectures
  • VLSI Systems and Applications
  • Silicon Solar Cells and Technologies
  • CIGS-II-VI and Related Thin Film Cells
  • III-V Materials and Devices for Concentrator and Space PV Systems
  • Photovoltaics with New Materials and Concepts
  • PV Architecture and PV systems
  • Power Devices (Si, Compound SC)
  • Electrodes, Electrolytes, Separators and Systems for Energy Storage (batteries, capacitors, fuel cells, etc.)
  • Photocatalysts and Photoelectrochemical Systems for Solar Fuels
  • Nanogenerators and Self-powered Systems
  • Thermoelectrics
  • Metrology and Inspection Methodologies (Device, Display, LED, Solar Cell, etc.)
  • Critical Dimension and Mask Related Metrologies
  • Overlay, Registration, and Alignment Metrologies
  • Process Control and Characterization
  • Defect Detection and Control
  • Nanoanalysis with Structure, Surface, and Chemical Measurements
  • Quality Assurance and Yield Enhancement
  • Measurement System Modeling and Simulation
  • Software architecture for new semiconductor technology
  • Simulation and Emulation techniques for storage design
  • Software for Fusion semiconductor
  • File system and FTL (Flash Translation Layer)
  • Storage Algorithms
  • I/O Stack Analysis
  • Virtualization for memory and storage
  • Low power storage
  • Bigdata issues on storage
  • Memory management and Caching algorithms
  • Chip implementation results from university (ASIC / FPGA)