Á¦23ȸ Çѱ¹¹ÝµµÃ¼Çмú´ëȸ

A. Interconnect & Package
ºÐ°úÀ§¿øÀå ÀÌÈÄÁ¤ (¼º±Õ°ü´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÀÌ¿õ¼± (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø °û³ëÁ¤ (SK ÇÏÀ̴нº), ±Ç¿ÀÁß (ÀÎõ´ëÇб³),±è±¸¼º (°­³²´ëÇб³), ±è¼±Á¤ (¿ï»ê´ëÇб³), ±è¼öÇö (¿µ³²´ëÇб³),
±è½Ã¹ü (¸Å±×³ªÄ¨¹ÝµµÃ¼), ±èÀº°æ (¼­¿ï°úÇбâ¼ú´ëÇб³), ±èÇüÁØ (¿¬¼¼´ëÇб³), ¹Ú¿µ¹è (¾Èµ¿´ëÇб³),
¼ÕÀ±Ã¶ (»ï¼ºÀüÀÚ), ¾È»óÈÆ (»ï¼ºÀüÀÚ), ¿©Á¾¼® (¿¬¼¼´ëÇб³), ÀÌ¿øÁØ (¼¼Á¾´ëÇб³), ÀÌÁ¾¹« (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
ÀÌÅÂÀ± (¿¬¼¼´ëÇб³), ÀÌÇѺ¸¶÷ (ÀÎõ´ëÇб³), Á¶Ã¶È£ (SK ÇÏÀ̴нº), Á¶ÅÂÁ¦ (»ï¼ºÀüÀÚ), ÁÖ¿µÃ¢ (¼­¿ï´ëÇб³)
B. Patterning
ºÐ°úÀ§¿øÀå ¾çÇöÁ¶ (SK ÇÏÀ̴нº)
°øµ¿ºÐ°úÀ§¿øÀå À¯¿øÁ¾ (¼º±Õ°ü´ëÇб³)
ºÐ°úÀ§¿ø ±èÇö¿ì (ÇѾç´ëÇб³), ½Å°æ¼· (»ï¼ºÀüÀÚ), ¾ÈÁøÈ£ (ÇѾç´ëÇб³), ¾Èâ³² (ASML), ¿À¿ëÈ£ (¿ø±¤´ëÇб³),
Á¤Áö¿ø (ÀÎÇÏ´ëÇб³), Á¤Áø±â (SK ÇÏÀ̴нº), ȲÂù (»ï¼ºÀüÀÚ)
C. Material Growth & Characterization
ºÐ°úÀ§¿øÀå ¹ÚÁø¼· (ÇѾç´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¼ÛÁøµ¿ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)
ºÐ°úÀ§¿ø ±Ç¼ø¿ë (¿ï»ê°úÇбâ¼ú´ëÇб³), ¹ÚÀÏ±Ô (¿µ³²´ëÇб³), ¼ÛÁ¤ÈÆ (°øÁÖ´ëÇб³), ÀÌ°ø¼ö (»ï¼ºÀüÀÚ),
ÀÌ»óÁØ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌÁرâ (Àü³²´ëÇб³), ÀÌö·Î (ÀüºÏ´ëÇб³), Á¶¿ëÈÆ (KAIST)
D. Thin Film Process Technology
ºÐ°úÀ§¿øÀå ¹Î¿ä¼Á (°Ç±¹´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Àü»óÈÆ (°í·Á´ëÇб³)
ºÐ°úÀ§¿ø ±èÇü¼· (¼º±Õ°ü´ëÇб³), ¹ÚÁ¤ÈÆ (SK ÇÏÀ̴нº), ¹ÚÅÂÁÖ (ÇѾç´ëÇб³), À±¼º¹Î (°æÈñ´ëÇб³), ÀÌ»ó¿î (¾ÆÁÖ´ëÇб³),
Á¤¼±È£ (Çѱ¹È­Çבּ¸¿ø), Á¶¼º¸ñ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Á¶¿µÁø (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ÃÖ¸®³ë (ÀÎÇÏ´ëÇб³),
ÃÖâȯ (ÇѾç´ëÇб³), Ȳ±âÇö (»ï¼ºÀüÀÚ)
E. Compound Semiconductors
ºÐ°úÀ§¿øÀå ÀåÅÂÈÆ (ÀüºÏ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±è±Ô»ó (»óÁö´ëÇб³)
ºÐ°úÀ§¿ø °ûÁؼ· (¼øõ´ëÇб³), ±ÇÇõÀÎ (Áß¾Ó´ëÇб³), ±èÁ¦¿ø (»ï¼ºÀüÀÚ), ¹®Àç°æ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
¹Îº´±Ô (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ¼­Àº°æ (ÀüºÏ´ëÇб³), ½É±Ôȯ (ÀüºÏ´ëÇб³), À±Çü¼· (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
ÀÌÁ¤Èñ (°æºÏ´ëÇб³), ÀÓÁ¾¿ø (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Â÷È£¿µ (È«ÀÍ´ëÇб³)
F. Silicon and Group-IV Devices and Integration Technology
ºÐ°úÀ§¿øÀå Á¶¼ºÀç (°¡Ãµ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À̳»ÀÎ (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø ±è¼Ò¿µ (¼º±Õ°ü´ëÇб³), ±èÃáȯ (SK ÇÏÀ̴нº), ³²µ¿¿í (ÀÎÇÏ´ëÇб³), ½Åµ¿¼® (»ï¼ºÀüÀÚ), ½Åâȯ (¼­¿ï½Ã¸³´ëÇб³),
¾çÁö¿î (°í·Á´ëÇб³), À̺´ÈÆ (±¤ÁÖ°úÇбâ¼ú¿ø), À̼ºÁÖ (¼º±Õ°ü´ëÇб³), ÀÌÁ¾È£ (¼­¿ï´ëÇб³), ÀÌÃæÈ£ (»ï¼ºÀüÀÚ),
ÀÌÈñ´ö (Ãæ³²´ëÇб³), ÀüÀλó (Çѱ¹ Ulvac), Á¤¼º¿õ (SK ÇÏÀ̴нº), Ãֿ쿵 (¼­°­´ëÇб³)
G. Device & Process Modeling, Simulation and Reliability
ºÐ°úÀ§¿øÀå ±è´ëȯ (±¹¹Î´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¶Àοí (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø ¹Ú¹®¼ö (»ï¼ºµð½ºÇ÷¹ÀÌ), ¹ÚÂùÇü (±¤¿î´ëÇб³), ¹èÁ¾¿í (LGµð½ºÇ÷¹ÀÌ), À¯Çö¿ë(°í·Á´ëÇб³),
ÀÌ»ó±â (µ¿ºÎÇÏÀÌÅØ), À̼®±Ô (SK ÇÏÀ̴нº), À̼ºÇö (Çѱ¹¿Ü±¹¾î´ëÇб³), ÀÌÀç±Ô (»ï¼ºÀüÀÚ),
ÀÌÁ¤¼ö (Æ÷Ç×°ø°ú´ëÇб³), ÃÖ¼ºÁø (±¹¹Î´ëÇб³)
H. Display and Imaging Technologies
ºÐ°úÀ§¿øÀå ¹èº´¼º (È£¼­´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÃÖº´´ö (ÇѾç´ëÇб³)
ºÐ°úÀ§¿ø ±¸º»¿ø(»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ±ÇÀåÇõ (°æÈñ´ëÇб³), ±è¿µ¼® (ÀüÀÚºÎÇ°¿¬±¸¿ø), ±èÀçÈÆ (ÇѾç´ëÇб³), ³ë¿ë¿µ (µ¿±¹´ëÇб³),
¸ð¿¬°ï (»ï¼ºµð½ºÇ÷¹ÀÌ), ¹®Ã¶Èñ (È£¼­´ëÇб³), ¹Ú»óÈñ (KAIST), ¼ÛÁ¤±Ù (µ¿¾Æ´ëÇб³), À̽¿ì (°æÈñ´ëÇб³),
ÀÌ¿ìÀç (ÀÌ¿£¿¡ÇÁÅ×Å©³î·ÎÁö), Á¤Àç°æ (ÀÎÇÏ´ëÇб³), Á¤ÇåÁØ (Ŭ·¹¾îÇȼ¿¢ß), Á¶Á¤´ë (Çѱ¹±â°è¿¬±¸¿ø),
Áøº´µÎ (´Ü±¹´ëÇб³), È«¹®Ç¥ (°í·Á´ëÇб³), È«¿Ï½Ä (¼­¿ï½Ã¸³´ëÇб³), È«¿ëÅà (¼­¿ï´ëÇб³)
I. MEMS & Sensors Systems
ºÐ°úÀ§¿øÀå ±è»óÀÎ (¾ÆÁÖ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÇÑ»ó¿í (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)
ºÐ°úÀ§¿ø °­°üÇü (Æ÷Ç×°ø°ú´ëÇб³), ±Ç¼øÈ« (Áß¾Ó´ëÇб³), ±èµ¿Çö (¿¬¼¼´ëÇб³), ±è¿µ¹Î (È«ÀÍ´ëÇб³), ³²È¿Áø (LGÀüÀÚ),
·ùÇÑ¿­ (ÀÎÇÏ´ëÇб³), ¹®¼º¿í (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø), ½ÅÇüÀç (»ï¼ºÀüÀÚ), À¯°æ½Ä ( KAIST),
Àå¿øÀÍ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Àüµ¿È¯ (Çѱ¹³ª³ë±â¼ú¿ø), Á¶¼ºº¸ (°¡Ãµ´ëÇб³)
J. Nano-Science & Technology
ºÐ°úÀ§¿øÀå ±è»ó¿í (KAIST)
°øµ¿ºÐ°úÀ§¿øÀå Á¤¼ºÁØ (»ï¼ºÁ¾ÇÕ±â¼ú¿ø)
ºÐ°úÀ§¿ø °­±â¼® (¼­¿ï´ëÇб³), ±è¿õ (°í·Á´ëÇб³), ¹Úº´±¹ (KAIST), ¹Ú¿øÀÏ (ÇѾç´ëÇб³), ¹Úö¹Î (¿¬¼¼´ëÇб³), ÀÌ°ÇÀç (KAIST),
À̸íÀç (±âÃÊ°úÇבּ¸¿ø), ÀÌ¿ì (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌŹÈñ (¼­¿ï´ëÇб³), ÀÌÅ¿ì (Æ÷Ç×°ø°ú´ëÇб³),
Á¤¿¬½Ä (KAIST), Á¶°æ»ó (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ÃÖ¼ºÀ² (KAIST)
K. Memory (Design & Process Technology)
ºÐ°úÀ§¿øÀå ¹é½ÂÀç (ÇÑ°æ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±è¼ö±æ (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø °­¸í°ï (Çѱ¹±³Åë´ëÇб³), ±Ç¿ë¿ì (È«ÀÍ´ëÇб³), ±è¿µÈñ (â¿ø´ëÇб³), ±è¿ë±â (SK ÇÏÀ̴нº),
±èÅý (SK ÇÏÀ̴нº), ¹Î°æ½Ä (±¹¹Î´ëÇб³), ¹éÀÎ±Ô (»ï¼ºÀüÀÚ), ¼Õ¿ëÈÆ (»ï¼ºÀüÀÚ), ÀÌÀ籸 (»ï¼ºÀüÀÚ),
ÀÌÁßÈ£ (¿ëÀδëÇб³), Á¶¼ºÀÍ (ÀüºÏ´ëÇб³), Á¶¿ì¿µ (»ï¼ºÀüÀÚ), ÃÖ¿µµ· (»ï¼ºÀüÀÚ), È«»óÈÆ (°æÈñ´ëÇб³)
L. Analog Design
ºÐ°úÀ§¿øÀå ¹é±¤Çö (Áß¾Ó´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÀçÁø (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø ±è¼öȯ (¼­¿ï´ëÇб³), ±è½ÃÈ£ (¿¬¼¼´ëÇб³), ±è¿ë½Å (°í·Á´ëÇб³), ±èÅ¿í (¿¬¼¼´ëÇб³), ³ëÁ¤Áø (ÇѾç´ëÇб³),
·ù½ÂŹ (KAIST), ¹®¿ë (¼þ½Ç´ëÇб³), ¼Û¹Î±Ô (µ¿±¹´ëÇб³), ½ÉÀçÀ± (Æ÷Ç×°ø°ú´ëÇб³), ¾È±æÃÊ (¼­°­´ëÇб³),
À¯Ã¢½Ä (ÇѾç´ëÇб³), À̽ÂÈÆ (¼­°­´ëÇб³), ÀÌÀ±½Ä (ÀüÀÚºÎÇ°¿¬±¸¿ø), ÀÓ½ÅÀÏ (¼­°æ´ëÇб³), Á¶Á¦±¤ (LGÀüÀÚ),
ÃÖÀ±°æ (»ï¼ºÀüÀÚ), ÃÖÁßÈ£ (¼­¿ï½Ã¸³´ëÇб³), È«±¹Å (LGÀüÀÚ)
M. RF and Wireless Design
ºÐ°úÀ§¿øÀå ÀÌÁ¾¿í (°æÈñ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁعè (¢ß¾Æ³ªÆнº)
ºÐ°úÀ§¿ø ±è¿µÁø (Çѱ¹Ç×°ø´ëÇб³), ±èÁøÅ (°Ç±¹´ëÇб³), ±èõ¼ö (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ±èÅ¿í (¿¬¼¼´ëÇб³),
³²Àϱ¸ (ºÎ»ê´ëÇб³), ¹Îº´¿í (¿¬¼¼´ëÇб³), ¹éµ¿Çö (Áß¾Ó´ëÇб³), ½ÅÇöö (±¤¿î´ëÇб³), ¿Õ¼ºÈ£ (RadioPulseInc.),
ÀÌ°­À± (¼º±Õ°ü´ëÇб³), À̹ÎÀç (±¤ÁÖ°úÇбâ¼ú¿ø), ÀÌÁ¾¿í (°æÈñ´ëÇб³), À±»ó¿õ (°æÈñ´ëÇб³), Á¶¼ºÈ¯ (KAIST)
N. VLSI CAD
ºÐ°úÀ§¿øÀå ÀÌÁ¾Àº (¿ï»ê°úÇбâ¼ú´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¤Àç¿ë (ÀÎõ´ëÇб³)
ºÐ°úÀ§¿ø °­¿ë¼® (LGÀüÀÚ), ±è¿µ¹Î (¿ï»ê°úÇбâ¼ú´ëÇб³), ±èÀ±Áø (¼÷¸í¿©ÀÚ´ëÇб³), ±èÈ«½Ä (SK ÇÏÀ̴нº), ¹Ý¿ëÂù (LG ÀüÀÚ),
¾çÁؼº (¼º±Õ°ü´ëÇб³), À¯½ÂÁÖ (¼­¿ï´ëÇб³), ÀÌ°­Èñ (»ï¼ºÀüÀÚ), Á¤ÀÇ¿µ (¿¬¼¼´ëÇб³), Á¶¿µÃ¶ (»ï¼ºÀüÀÚ),
ÃÖÁ¤¿¬ (»ï¼ºÀüÀÚ)
O. System LSI Design
ºÐ°úÀ§¿øÀå ¹ÚÁ¾¼± (°í·Á´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±è°æ±â (´ë±¸´ëÇб³)
ºÐ°úÀ§¿ø °­¼®Çü (¿ï»ê°úÇбâ¼ú´ëÇб³), °øÁØÁø (»ï¼ºÀüÀÚ), ±èÁöÈÆ (Ãæ³²´ëÇб³), ±èÁø»ó (°æÈñ´ëÇб³), ±èÅÂȯ (Ç×°ø´ëÇб³),
³²º´±Ô (Ãæ³²´ëÇб³), À̱¤¿± (¼­°æ´ëÇб³), À̼º¼ö (¼þ½Ç´ëÇб³), ÀÌ¿µÁÖ (±¤¿î´ëÇб³), ÀÌÀ±¸í (¼º±Õ°ü´ëÇб³),
ÀÌÀçÁø (¼­¿ï´ëÇб³), ÀÌÁ¾¿­ (ÀüºÏ´ëÇб³), ÀÌÁø¾ð (»ï¼ºÀüÀÚ), ÀÌÂùÈ£ (¼þ½Ç´ëÇб³), ÀÌäÀº (ÀÎÇÏ´ëÇб³),
ÀÌÇÑÈ£ (ÀÎÇÏ´ëÇб³), ÀåÀÍÁØ (°æÈñ´ëÇб³), Á¤°Ç¿Á (À¯ÇÑ´ëÇб³), Á¤±â¼® (ÇѾç´ëÇб³), Á¤Áø±Õ (ÀüºÏ´ëÇб³),
Á¶°æ·Ï (ÃæºÏ´ëÇб³), Ãֱ⿵ (¼­¿ï´ëÇб³), ÃÖÁظ² (°æºÏ´ëÇб³), ÇÑÅÂÈñ (¼º±Õ°ü´ëÇб³)
P. Device for Energy (Solar Cell, Power Device, Battery, etc.)
ºÐ°úÀ§¿øÀå ¸íÀç¹Î (¿¬¼¼´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±èÀ±±â (»ï¼º SDI)
ºÐ°úÀ§¿ø ±è¿µÈ¯ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø), ±èÇüŹ (È«ÀÍ´ëÇб³), ¹Ú¼º±â (¢ß¿¡½º¿£ÅØ), ¼ÛÈñÀº (Çѱ¹¿¡³ÊÁö±â¼ú¿¬±¸¿ø),
Á¤ÁØÈ£ (Çѱ¹±â°è¿¬±¸¿ø), Á¤Çö¼® (¼º±Õ°ü´ëÇб³), Á¼ºÈÆ (¼­¿ï»ê¾÷´ëÇб³), ÇÔ¹®È£ (±¤ÁÖ°úÇбâ¼ú¿ø)
Q. Metrology, Inspection, and Yield Enhancement
ºÐ°úÀ§¿øÀå ±èÈ£¼· (¼±¹®´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À¯Çü¿ø (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø ±èÁßÁ¤ (»ï¼ºÀüÀÚ), ±èÀç»ï (³ª³ë¸ÞÆ®¸¯½ºÄÚ¸®¾Æ¢ß), ±èÁø½Â (ÀüºÏ´ëÇб³), ¹Úº´Ãµ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø),
¹è¿¬È£ (KLA-Tencor), ¾çÁظð (³ª³ëÁ¾ÇÕ±â¼ú¿ø), ¿ìºÀÁÖ (¢ß½ê¹Ì½Ã½ºÄÚ), À̺´È£ (Ultratech), ÀÌ»ó±æ (»ï¼ºÀüÀÚ),
ÀÓ¼±Á¾ (Çѱ¹±â°è¿¬±¸¿ø), Á¶¿ëÀç(Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÇÑÀç¿ø (¿¬¼¼´ëÇб³)
R. Semiconductor Software
ºÐ°úÀ§¿øÀå ¹ÝÈ¿°æ (ÀÌÈ­¿©ÀÚ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹é½ÂÀç (´Ü±¹´ëÇб³)
ºÐ°úÀ§¿ø °­¼ö¿ë (ÇѾç´ëÇб³), ±èÁ¾¹Î (»ï¼º), ±èż® (±¤¿î´ëÇб³), ³ë»ïÇõ (È«ÀÍ´ëÇб³), ¹ÎÈ« (È£¼­´ëÇб³),
½Åµ¿±º (¼º±Õ°ü´ëÇб³), ¿øÀ¯Áý (ÇѾç´ëÇб³), À̵¿Èñ (¼­¿ï½Ã¸³´ëÇб³), ÀÌÀºÁö (ÃæºÏ´ëÇб³), ÀÌâ°Ç (¼­¿ï´ëÇб³),
ÀÓÈ¿ÁØ (LGÀüÀÚ), Á¶»ó¿¬ (»ï¼ºÀüÀÚ), ÁÖ¿ë¼ö (±¹¹Î´ëÇб³), ÃÖÁ¾¹« (´Ü±¹´ëÇб³), ÇãÁØ¿µ (ÇѼº´ëÇб³)