Interconnect

Metallization & Low-k Dielectrics Thin Film Deposition for Interconnect: ALD, Plating, Sputtering, PECVD, Spin-on Dielectrics, etc. Planarization Technology for Dielectrics and Metal Silicides, Contact, Barrier, Plug Materials Process Integration, Modeling, Simulation & Reliability for Interconnect Passive Component Integration and Characterization New Concept Interconnect (Optical, RF, Microwave,magnetic, etc.) Novel Interconnect Materials including CNT, Graphene, Nanowire, etc. Interconnect for Other Devices: Transparent Conducting Oxides, Roll-to-Roll Processing, Printing Process, etc

Packaging & Test

Electronic packaging materials & Processes Electronic packaging Design, Simulation & Reliability Test 3D and 2.5D packages Emerging Packaging Technologies Test (wafer-level test, packaging-level test)

Lithography	Optical, EUV, E-Beam, Imprint Lithography Multiple Patterning Simulation and Optical Proximity Correction Design for Manufacturing Photoresist and Related Process Mask Technology Overlay control DSA(Directed Self-assembly)
Dry Etching	Plasma & Surface Reactions Conductor & Si Etching Dielectric Etching Plasma Etching for Emerging Materials Plasma Etching for Advanced 3D Structures Plasma Diagnostics Modeling and Simulation Plasma Equipments New Dry Processes Advanced Process Control (APC)

Bulk and nano-structured Growth and Characterization (IV, III-V, II-VI Compound Semiconductors) Epitaxial Growth of Thin Film and Nano Structures (IV, IV-IV, III-V, II-VI Compound Semiconductors) Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, III-V on Si etc.) Selective Epitaxy and Regrowth for Device Applications Growth of Nanostructures for Nitride and Oxide Semiconductors Bottom-up Growth of Nanohybrid Structures and Applications. New Characterization Methods for Materials and Devices Growth and Characterization of Carbon Related Materials (Graphene, Graphite Oxide, CNT, etc.)

Advanced Gate Stack, Channel Process, and Integration Technology Novel Thin Film Processes Advanced DRAM Capacitor Materials and Devices New Memory Materials and Devices Thin Film Transistor (TFT) Process and Materials Thin Film Processes for Photovoltaics Sensors and Actuators Materials and Devices Compound Semiconductor Materials and Devices Organic Thin Films Carbonic or Dichalcogenide 2D Materials and Devices Low Temperature (<100) Thin Film Deposition and Applications Thin Film Characterization Methodologies Thin Film Deposition and Treatment Apparatus for Mass Production

III-V Electronic and Optoelectronic Devices SiC, SiGe, and Other Compound Semiconductor Devices HBTs, HEMTs, and HFETs LEDs, LDs, and Photodiodes RFICs, MMICs and HICs High Frequency and High Power Electronics Novel Devices and Materials New Process Technologies Metastable Surface Processing Backside Processing Manufacturing and Packaging Reliability, ESD, and Quality Issues

Novel CMOS and Post-CMOS Devices and Processes(e.g. FinFET, Nanowire Transistor, etc.) 3D NAND flash memory and array architecture Analog/RF Devices and Processes High Voltage and Power Devices and Processes Novel Materials and Processes for CMOS Devices(e.g. Junction, Contact, Gate Stack, etc.) Reliability Issues of CMOS and Post-CMOS Devices and Processes (e.g. HCI, BTI,Self-Heating, etc.) Test Structures and Methodologies of CMOS and Post-CMOS Devices and Processes Device and Process Variations Device and Circuit Co-Optimization Si Electronics and Photonics Convergence

Device/Process Modeling and Simulation (Compact Modeling, Particle or Continuum-level Device/Process Simulations, Atomistic Approaches for Growth, Fabrication, Transport Simulations, etc.) Modeling and Simulation for Novel Semiconductor Devices (FinFETs, Ultra-Thin-Body MOSFETs, III-V MOSFETs, Tunnel FETs, Spintronic FETs, Carbon-based FETs, Charge Trap Devices, etc.) Device Characterization, Variability and Yield (Device Model-Parameter Extraction, Random DopantFluctuations, Random Telegraph Noise, Yield Analysis, etc.) Reliability (Hot Carrier Effect, Time-DependentDielectric Breakdown, Device Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical Overstress, ElectrostaticDischarge (ESD) effects, etc.) Semi-Classical/Quantum Transport and Simulation of Nano-scale FET devices

Active Matrix Devices Liquid Crystal Technology Organic Light Emitting Displays LED and Lighting Flexible Displays Display Manufacturing and Equipment Thin Film Electronics Imaging Technologies Display and Imaging Device Driving Technology Circuits for Display and Imaging Device Display and Imaging Optics 3D Displays MEMS Displays Touch Panel Technology Emerging Displays

Macro/Meso/Micro/Nano/Quantum Sensors & Systems Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors & Systems Smart/Intelligent/Integrated/Ubiquitos/IoT Sensor/Systems MEMS and Microsystems & Nanosystems Bio/Biomedical MEMS Micro Fluidics and Lab-on-a-Chip Optical and RF MEMS Power Microsystems Micro/NanoMaterials and Fabrications

Graphene and Related Carbon Nanostructures Two-Dimensional Materials beyond Graphene Nanophotonic Materials and Devices Quantum Dot Photonics and Photovoltaics Soft Electronic/Photonic Materials and Devices Nanoscale Materials and Systems for Energy Conversion/Storage Quantum Transport Phenomena Related to Nanostructures Nanofabrication and Self-Assembly for Device Applications Spintronics: Materials and Devices Theoretical Transport Physics for Nanostructures

New Memory Cells / Device Concepts & Innovations Memory Process Technology Innovation and Advanced Processes Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories Emerging Memory Modeling / Design / Process / Device / Applications for MRAMs, FeRAMs, PRAMs/PCRAMs, ReRAMs/RRAMs, Spin-Torque-Transfer Memories/Spin Memories, NEMS, Nano-Crystal, and FinFET, memristors, memristive devices, new 3D Memories, byte addressable persistent memories, etc Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design New memory technologies for bio-inspired applications such as neuromorphic ones

Analog Building Blocks Data Converters Power Circuits Energy Harvesting Circuits Display Driver I Cs Image Sensors & Smart Sensors Clock Recovery & Generation Ultra Low Power Analog /Mixed-Signal Design Techniques Bio/Biomedical/mobile healthcare ICs Sensor Signal Conditioning Circuits MEMS analog circuits

Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers Mixers, VCOs, and Frequency Synthesizers RF and Wireless Transceiver ICs RF IC Design Techniques High-speed Serial Interface Circuits Millimeter-Wave ICs RF Photonics ICs and Systems RF Device Modeling Terahertz ICs

Hardware/software co-design Architecture, logic, physical synthesis Simulation/verification Deep submicron signal integrity Low power design methodology High performance design methodology Mixed-signal/RF design methodology Technology CAD Testing, Design for testability (DFT) GPU-based implementation of CAD algorithms Near threshold voltage design methods Other applications of CAD algorithms

Processor/Multi-Core Architectures and Software Embedded Systems and Software Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling High-Speed Low-Power Circuits and Systems Circuits and Systems for Communications Circuits and Systems for Digital Signal Processing / Visual Signal Processing Circuits and Systems for Storages (Memory Controller, eMMC, Solid-State Drive, etc.) Circuits and Systems for Security Error Correction Coding Algorithm and Architectures Multimedia Algorithm and Architectures VLSI Systems and Applications

Crystalline Silicon Solar Cells and Technologies PV Modules and System Components Including Testing and Reliability CIGS-II-VI and Related Thin Film Cell Amorphous and Nano/Microcrystalline Silicon Based Solar Cells and Related Materials III-V Materials and Devices for Concentrator and Space PV Systems Photovoltaics with Nanocomposites and Other New Concepts PV Architecture and PV systems Power Devices (Si, Compound SC) Cathod/Anode Materials in Battery Electrolytes and separators in Battery Safety and reliability in Battery Cell design and evaluation in Battery

Metrology and Inspection Methodologies Critical Dimension Metrologies Overlay, Registration, and Alignment Metrologies Process Control and Characterization Quality Assurance and Yield Enhancement Defect Detection, Analysis and Control Measurement System Modeling and Simulation Mask Related Metrology LCD / OLED Related Metrology

Software architecture for new semiconductor technology Simulation and Emulation techniques for storage design Software for Fusion semiconductor File system and FTL (Flash Translation Layer) Storage Algorithms I/O Stack Analysis Virtualization for memory and storage Low power storage Bigdata issues on storage Memory management and Caching algorithms