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- Metallization & Low-k Dielectrics
- Planarization Technology for Dielectrics and Metal
- Metal Electrode &Transparent Conducting Oxides
- Silicide / Salicide& Contact, Barrier, Plug Materials
- Process Integration, Modeling, Simulation & Reliability for Interconnect
- Passive Component Integration and Characterization
- New Concept Interconnect (3D, RF, Microwave, Optical, Inkjet etc.)
- Novel Interconnect Materials including CNT, Graphene, Nanowire etc

- Packaging Materials & Processes
- Advanced Packages (Flip chip / CSP/WLP / MCP / SiP / TSV)
- RF / MEMS / Sensor / Solid State Lighting Packaging and Integration
- Actives and Passives Embedding Technologies
- EMI Solution
- Package Design, Reliability, Simulation & Test
- High Density Substrate & SMT
- Printed Electronics for Package
- Emerging Package Technologies

- Optical, EUV, E-Beam, Imprint Lithography
- Double Patterining
- Optical Proximity Correction
- Photoresist and Related Process
- Mask Technology

- Plasma & Surface Reactions
- Conductor & Si Etching
- Dielectric Etching
- Plasma-Induced Damage
- Plasma Diagnostics
- Modeling and Simulation
- Plasma Equipment
- Monitoring Systems
- New Dry Process & Classification (FDC)
- Advanced Process Control (APC)

- Bulk Semiconductor Growth (IV, III-V, II-VI Compound)
- Thin Film Epitaxial Growth (IV, IV-IV, III-V, II-VI Compound)
- Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, etc.)
- Characterization of Epitaxial Films and Compound Semiconductors
- Selective Epitaxy for Device Applications
- Nitride and Oxide Semiconductors
- Growth and Characterization of Carbon Related Materials (Graphene, Graphite Oxide, CNT, etc.)

- High-k Dielectrics
- Metal Gate and Integration Technology
- Novel Thin Film Processes
- Advanced DRAM Capacitor Materials and Devices
- New Memory Materials
- Organic Thin Film
- Low Temperature (<100C) Thin Deposition and Application
- Advanced Thin Film Deposition and Treatment Apparatus for Mass Production

- III-V Electronic and Optoelectronic Devices
- SiC, SiGe, and Other Compound Semiconductor Devices
- HBTs, HEMTs, and MISFETs
- LEDs, LDs, and Photodiodes
- Low-Dimensional and Quantum Effect Devices
- Compounds Semiconductor RFICs, MMICs and HICs
- ESD, Reliability, and Quality Issues
- New Process Technologies

- Impacts of Device and Process Variations
- Reliability and Novel Test Methodologies of Scaled CMOS
- New Materials for Scaled CMOS
  (Isolation, Silicides, Channel Materials - III-V, Ge, Graphene)
- New Processes for Scaled CMOS
  (Junction, Activation, Strain Engineering (CESL, SPT, SMT))
- Novel Devices for CMOS Applications (Bulk Devices, SOI Devices)
- Non Planar Devices (finFET, MUGFET)
- Gate Stack Technology for Scaled CMOS
- CMOS Technology for SRAM in High Performance and Low Power Applications
- Analog/RF CMOS Processes and Devices
- High Voltage Devices

- Process / Device Modeling and Simulation
- Device Characterization, Reliability and Yield (Hot Carrier Effect, Bias-Temperature Instability,
  Oxide Breakdown, Device Degradation, Yield Analysis, etc.)

- AMD (Active Matrix Device)
- Silicon Based TFT, Organic TFT, Oxide TFT, New TFT
- Liquid Crystal Display (LCD)
- Plasma Display
- OLED
- LED/Lighting
- Flexible Display
- Printable Electronics
- Display Electronics
- Display and Imaging Device Driving Technology
- Transparent Conducting Electrode Technology
- Active Display Manufacturing/Equipment

- Macro / Meso / Micro / Nano Sensors
- Mechanical / Thermal / Magnetic / RF / Optical / Chemical / Bio / Medical Sensors
- Smart/Intelligent/Integrated/ Ubiquitous Sensor/Systems
- MEMS and Microsystems
- Bio/Biomedical MEMS
- Micro Fluidics and Lab-on-a-Chip
- Optical and RF MEMS
- Power Microsystems
- Micro/Nano Material and Fabrication

- Group IV Photonic Materials and Devices
- Graphene and Related Carbon Nanostructures: Syntheses and Devices
- Soft Electronic Materials and Devices
- Semiconductor Nanowires: Materials and Devices
- Quantum Dot Photonics and Photovoltaics
- Nanoscale Energy Conversion Vehicles
- Quantum Transport Phenomena Related to Nanostructures
- 3D-Nanostructure Fabrications and Their Applications
- Modeling and Simulation of Nano-Devices

- New Memory Cells / Device Concepts & Innovations
- Memory Process Technology Innovation and Advanced Processes
- Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs,
  Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories
- Emerging Memory Design / Process / Device Technologies / Applications including MRAMs, FeRAMs,
  PCMa, RRAMs (Resistance Change RAM), Spin-Torque-Transfer Memories, NEMS Based, Nano-Crystal,
  FinFET and 3D Memories
- Memory Test, yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design

- Analog Building Blocks
- Data Converters
- Power Circuits
- Display Driver ICs
- Image Sensors & Smart Sensors
- Clock Recovery & Generation
- Analog / Mixed-Signal Design Techniques
- Bio / Biomedical ICs

- Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers
- Mixers, VCOs, and Frequency Synthesizers
- RF Transceiver ICs
- RF IC Design Techniques
- High-speed Serial Interface Circuits
- Millimeter-Wave ICs
- RF Photonics ICs and Systems
- RF Device Modeling
- Terahertz ICs

- Hardware / Software Co-Design
- Architecture, Logic, Physical Synthesis
- Simulation / Verification
- Deep Submicron Signal Integrity
- Low Power Design Methodology
- High Performance Design Methodology
- Mixed-Signal / RF Design Methodology
- Technology CAD
- Testing, Design for Testability

- Microprocessor and Network Processor
- Processor OS, Compiler, Simulator
- Digital System Modeling: Memory / Bus / IO
- High speed / Low Power Digital Circuit Logic / Circuit
- Circuits and Systems for Communications / Storages (Memory Controller, eMMC, Solid-State Drive, etc.): ECC and other Channel Signal Processing Algorithm and Hardware Architecture
- Circuits and Systems for Digital Signal Processing / Multimedia Signal Processing
- VLSI Systems and Applications

- Crystalline Silicon Solar Cells and Technologies
- PV Modules and System Components Including Testing and Reliability
- CIGS-II-VI and Related Thin Film Cell
- Amorphous and Nano / Microcrystalline Silicon Based Solar Cells and Related Materials
- III-V Materials and Devices for Concentrator and Space PV Systems
- Photovoltaics with Nanocomposites and Other New Concepts
- PV Architecture and PV Systems

- Metrology and Inspection Methodologies
- Critical Dimension Metrologies
- Overlay, Registration, and Alignment Metrologies
- Process Control and Characterization
- Quality Assurance and Yield Enhancement
- Defect Detection, Analysis and Control
- Measurement System Modeling and Simulation
- Mask Related Metrology
- LCD / OLED Related Metrology