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A. Interconnect & Package
ºÐ°úÀ§¿øÀå ÀÌ¿øÁØ(¼¼Á¾´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÀÌ¿õ¼±(SKÇÏÀ̴нº)
ºÐ°úÀ§¿ø °û³ëÁ¤ (SKÇÏÀ̴нº), ±è±¸¼º (°­³²´ëÇб³), ±è¼öÇö (¿µ³²´ëÇб³), ±è½Ã¹ü (¸Å±×³ªÄ¨¹ÝµµÃ¼),
±èÇüÁØ (¿¬¼¼´ëÇб³), ¹Ú¿µ¹è (¾Èµ¿´ëÇб³), ÀÌÅÂÀ± (¿¬¼¼´ëÇб³), ÀÌÇÑÃá (µ¿ºÎÇÏÀÌÅØ),
ÀÌÈÄÁ¤ (¼º±Õ°ü´ëÇб³), ÁÖ¿µÃ¢ (¼­¿ï´ëÇб³), ±èÀº°æ (¼­¿ï°úÇбâ¼ú´ëÇб³), ±è¼±Á¤ (¿ï»ê´ëÇб³),
¿©Á¾¼® (¿¬¼¼´ëÇб³), ÀÌÁ¾¹« (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Á¶ÅÂÁ¦ (»ï¼ºÀüÀÚ), ¾È»óÈÆ (»ï¼ºÀüÀÚ)

B. Patterning
ºÐ°úÀ§¿øÀå ¾çÇöÁ¶(SKÇÏÀ̴нº)
°øµ¿ºÐ°úÀ§¿øÀå À¯¿øÁ¾(¼º±Õ°ü´ëÇб³)
ºÐ°úÀ§¿ø ½Å°æ¼· (»ï¼ºÀüÀÚ), ±èÇö¿ì (ÇѾç´ëÇб³), ¾Èâ³² (ASML), ¿À¿ëÈ£ (¿ø±¤´ëÇб³), Á¤Áö¿ø (ÀÎÇÏ´ëÇб³),
¾ÈÁøÈ£ (ÇѾç´ëÇб³), Á¤Áø±â (SKÇÏÀ̴нº), ȲÂù (»ï¼ºÀüÀÚ)

C. Material Growth & Characterization
ºÐ°úÀ§¿øÀå ¹ÚÁø¼·(ÇѾç´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¼ÛÁøµ¿(Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)
ºÐ°úÀ§¿ø ±Ç¼ø¿ë (¿ï»ê°úÇбâ¼ú´ëÇб³), ¹ÚÀÏ±Ô (¿µ³²´ëÇб³), ¼ÛÁ¤ÈÆ (°øÁÖ´ëÇб³), ÀÌ°ø¼ö (»ï¼ºÀüÀÚ),
ÀÌ»óÁØ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌÁرâ (Àü³²´ëÇб³), ÀÌö·Î (ÀüºÏ´ëÇб³), Á¶¿ëÈÆ (KAIST)

D. Thin Film Process Technology
ºÐ°úÀ§¿øÀå Ȳ±âÇö(»ï¼ºÀüÀÚ)
°øµ¿ºÐ°úÀ§¿øÀå À±¼º¹Î(°æÈñ´ëÇб³)
ºÐ°úÀ§¿ø ±èÇü¼· (¼º±Õ°ü´ëÇб³), ¹Î¿ä¼Á (°Ç±¹´ëÇб³), ¹ÚÁ¤ÈÆ (SKÇÏÀ̴нº), ¹ÚÅÂÁÖ (ÇѾç´ëÇб³),
Àü»óÈÆ (°í·Á´ëÇб³), Á¤¼±È£ (Çѱ¹È­Çבּ¸¿ø), Á¶¼º¸ñ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
Á¶¿µÁø (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ÃÖ¸®³ë (ÀÎÇÏ´ëÇб³), ÃÖâȯ (ÇѾç´ëÇб³)

E. Compound Semiconductors
ºÐ°úÀ§¿øÀå ¹Îº´±Ô(Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø)
°øµ¿ºÐ°úÀ§¿øÀå ÀåÅÂÈÆ(Çѱ¹»ê¾÷±â¼ú´ëÇб³)
ºÐ°úÀ§¿ø  °ûÁؼ· (¼øõ´ëÇб³), ±èÁ¦¿ø (»ï¼ºÀüÀÚ), ¹®Àç°æ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ½É±Ôȯ (ÀüºÏ´ëÇб³),
À±Çü¼· (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ÀÌÁ¤Èñ (°æºÏ´ëÇб³), ÀÓÁ¾¿ø (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
Â÷È£¿µ (È«ÀÍ´ëÇб³), ¼­Àº°æ (ÀüºÏ´ëÇб³), À¯Àç¼ö (°æÈñ´ëÇб³)


F. Silicon Device & Integration Technology
ºÐ°úÀ§¿øÀå Ãֿ쿵(¼­°­´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À̳»ÀÎ(»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø À̺´ÈÆ (±¤ÁÖ°úÇбâ¼ú¿ø), ½Åµ¿¼® (»ï¼ºÀüÀÚ), ¾çÁö¿î (°í·Á´ëÇб³), ÀÌÁ¾È£ (¼­¿ï´ëÇб³),
ÀÌÃæÈ£ (»ï¼ºÀüÀÚ), ÀÌÈñ´ö (Ãæ³²´ëÇб³), Á¤¼º¿õ (SKÇÏÀ̴нº), Á¶¼ºÀç (°¡Ãµ´ëÇб³),
±è¼Ò¿µ (¼º±Õ°ü´ëÇб³), ½Åâȯ (¼­¿ï½Ã¸³´ëÇб³), À̼ºÁÖ (¼º±Õ°ü´ëÇб³)


G. Device & Process Modeling, Simulation and Reliability
ºÐ°úÀ§¿øÀå ÀÌÀç±Ô(»ï¼ºÀüÀÚ)
°øµ¿ºÐ°úÀ§¿øÀå ½Å¹Îö(KAIST)
ºÐ°úÀ§¿ø ±è´ëȯ (±¹¹Î´ëÇб³), ¹ÚÂùÇü (±¤¿î´ëÇб³), ÀÌÁ¤¼ö (Æ÷Ç×°ø°ú´ëÇб³), Á¶Àοí (SKÇÏÀ̴нº),
ÃÖÀçÈÆ  (SKÇÏÀ̴нº), À̼ºÇö (Çѱ¹¿Ü±¹¾î´ëÇб³), ÀÌ»ó±â (µ¿ºÎÇÏÀÌÅØ), ¹Ú¹®¼ö (»ï¼ºµð½ºÇ÷¹ÀÌ),
¹èÁ¾¿í (LGµð½ºÇ÷¹ÀÌ)


H. Display and Imaging Technologies
ºÐ°úÀ§¿øÀå ¹èº´¼º(È£¼­´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÃÖº´´ö(ÇѾç´ëÇб³)
ºÐ°úÀ§¿ø ±¸º»¿ø (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ±ÇÀåÇõ (°æÈñ´ëÇб³), ±è¿µ¼® (ÀüÀÚºÎÇ°¿¬±¸¿ø), ±èÀçÈÆ (ÇѾç´ëÇб³),
³ë¿ë¿µ (µ¿±¹´ëÇб³), ¸ð¿¬°ï (»ï¼ºµð½ºÇ÷¹ÀÌ), ¹®Ã¶Èñ (È£¼­´ëÇб³), ¹Ú»óÈñ (KAIST),
¼ÛÁ¤±Ù (µ¿¾Æ´ëÇб³), À̽¿ì (»ï¼ºÀüÀÚ), ÀÌ¿ìÀç (ÀÌ¿£¿¡ÇÁÅ×Å©³î·ÎÁö), Á¤Àç°æ (ÀÎÇÏ´ëÇб³),
Á¤ÇåÁØ (Ŭ·¹¾îÇȼ¿¢ß), Á¶Á¤´ë (Çѱ¹±â°è¿¬±¸¿ø), Áøº´µÎ (´Ü±¹´ëÇб³), È«¹®Ç¥ (°í·Á´ëÇб³),
È«¿Ï½Ä (¼­¿ï½Ã¸³´ëÇб³), È«¿ëÅà (¼­¿ï´ëÇб³)


I. MEMS & Sensor Systems
ºÐ°úÀ§¿øÀå ¹®¼º¿í(Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)
°øµ¿ºÐ°úÀ§¿øÀå ±è»óÀÎ(¾ÆÁÖ´ëÇб³)
ºÐ°úÀ§¿ø °­°üÇü (Æ÷Ç×°ø°ú´ëÇб³), ±Ç¼øÈ« (Áß¾Ó´ëÇб³), ±èµ¿Çö (¿¬¼¼´ëÇб³), ±è¿µ¹Î (È«ÀÍ´ëÇб³),
³²È¿Áø (LGÀüÀÚ), ·ùÇÑ¿­ (ÀÎÇÏ´ëÇб³), ½ÅÇüÀç (»ï¼ºÀüÀÚ), À¯°æ½Ä (KAIST),
Àå¿øÀÍ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Á¶¼ºº¸ (°¡Ãµ´ëÇб³), ÇÑ»ó¿í (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø),
Àüµ¿È¯ (Çѱ¹³ª³ë±â¼ú¿ø)


J. Nano-Science & Technology
ºÐ°úÀ§¿øÀå ÀÌŹÈñ(¼­¿ï´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¶°æ»ó(»ï¼ºÁ¾ÇÕ±â¼ú¿ø)
ºÐ°úÀ§¿ø °­±â¼® (¼­¿ï´ëÇб³), ±è¿õ (°í·Á´ëÇб³), ±è»ó¿í (KAIST), ¹Ú¿øÀÏ (ÇѾç´ëÇб³),
¹Úö¹Î  (¿¬¼¼´ëÇб³), ¾ÈÁ¾Çö (¿¬¼¼´ëÇб³), ÀÌ¿ì (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌ°ÇÀç (KAIST),
ÀÌÅ¿ì (Æ÷Ç×°ø°ú´ëÇб³), ÀÌÇö¿ì (Æ÷Ç×°ø°ú´ëÇб³), Á¶¹®È£ (¿¬¼¼´ëÇб³), À̸íÀç (IBS)


K. Memory (Design & Process Technology)
ºÐ°úÀ§¿øÀå ¹Î°æ½Ä(±¹¹Î´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¶¿ì¿µ(»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø °­¸í°ï (»ï¼ºÀüÀÚ), °ø¹è¼± (¼º±Õ°ü´ëÇб³), ±è¼ö±æ (SKÇÏÀ̴нº), ±è¿µÈñ (â¿ø´ëÇб³),
±è¿ë±â (SKÇÏÀ̴нº), ±èÅý (SKÇÏÀ̴нº), ¹é½ÂÀç (ÇÑ°æ´ëÇб³), ÀÌÀ籸 (»ï¼ºÀüÀÚ),
Á¶¼ºÀÍ (ÀüºÏ´ëÇб³), ÃÖ¿µµ· (»ï¼ºÀüÀÚ), È«»óÈÆ (°æÈñ´ëÇб³)

L. Analog Design
ºÐ°úÀ§¿øÀå ¹é±¤Çö(Áß¾Ó´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÀçÁø(»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø À¯Ã¢½Ä (ÇѾç´ëÇб³), ±è¼öȯ (¼­¿ï´ëÇб³), ÃÖÀ±°æ (»ï¼ºÀüÀÚ), ±è½ÃÈ£ (¿¬¼¼´ëÇб³),
³ëÁ¤Áø (ÇѾç´ëÇб³), ·ù½ÂŹ (KAIST), ¹®¿ë (¼þ½Ç´ëÇб³), ¼Û¹Î±Ô (µ¿±¹´ëÇб³),
½ÉÀçÀ± (Æ÷Ç×°ø°ú´ëÇб³), ¾È±æÃÊ (¼­°­´ëÇб³), Á¶Á¦±¤ (LGÀüÀÚ), À̽ÂÈÆ (¼­°­´ëÇб³),
ÀÌÀ±½Ä (ÀüÀÚºÎÇ°¿¬±¸¿ø), ÀÓ½ÅÀÏ (¼­°æ´ëÇб³), ÃÖÁßÈ£ (¼­¿ï½Ã¸³´ëÇб³), ±è¿ë½Å (°í·Á´ëÇб³),
±èÅ¿í (¿¬¼¼´ëÇб³), È«±¹Å (LGÀüÀÚ)


M. RF Design
ºÐ°úÀ§¿øÀå ÀÌ°­À±(¼º±Õ°ü´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁعè(¢ß¾Æ³ªÆнº)
ºÐ°úÀ§¿ø ±è¿µÁø (Çѱ¹Ç×°ø´ëÇб³), ±èÁøÅ (°Ç±¹´ëÇб³), ±èõ¼ö (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ±èÅ¿í (¿¬¼¼´ëÇб³),
³²Àϱ¸ (ºÎ»ê´ëÇб³), ¹Îº´¿í (¿¬¼¼´ëÇб³), ¹éµ¿Çö (Áß¾Ó´ëÇб³), ½ÅÇöö (±¤¿î´ëÇб³),
¿Õ¼ºÈ£ (RadioPulseInc.), À̹ÎÀç (±¤ÁÖ°úÇбâ¼ú¿ø), ÀÌÁ¾¿í (°æÈñ´ëÇб³), Á¶¼ºÈ¯ (KAIST)

N. VLSI CAD
ºÐ°úÀ§¿øÀå ÀÌÁ¾Àº(UNIST)
°øµ¿ºÐ°úÀ§¿øÀå ±èÀ±Áø(¼÷¸í¿©ÀÚ´ëÇб³)
ºÐ°úÀ§¿ø ±èÅÂȯ (¼­¿ï´ëÇб³), À±¼º·Î (¼­¿ï´ëÇб³), À¯½ÂÁÖ (Æ÷Ç×°ø°ú´ëÇб³), Á¶¿µÃ¶ (»ï¼ºÀüÀÚ),
ÀÌ°­Èñ (»ï¼ºÀüÀÚ), ±è¿µ¹Î (¿ï»ê°úÇбâ¼ú´ëÇб³), Á¤Àç¿ë (ÀÎõ´ëÇб³), ¹Ý¿ëÂù (LGÀüÀÚ),
°­¿ë¼® (LGÀüÀÚ), Á¤ÀÇ¿µ (¿¬¼¼´ëÇб³), ±èÈ«½Ä (SKÇÏÀ̴нº), ÃÖÁ¤¿¬ (»ï¼ºÀüÀÚ)

O. System LSI Design
ºÐ°úÀ§¿øÀå ÀÌÇÑÈ£(ÀÎÇÏ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁ¾¼±(°í·Á´ëÇб³)
ºÐ°úÀ§¿ø °øÁØÁø (»ï¼ºÀüÀÚ), ±è¼±±â (»ï¼ºÀüÀÚ), ±èÁöÈÆ (Ãæ³²´ëÇб³), ±èÁø»ó (°æÈñ´ëÇб³),
³²º´±Ô (Ãæ³²´ëÇб³), À̱¤¿± (¼­°æ´ëÇб³), ÀÌÀçÁø (¼­¿ï´ëÇб³), ÀÌÁ¾¿­ (ÀüºÏ´ëÇб³),
ÀÌÂùÈ£ (¼þ½Ç´ëÇб³), ÀåÀÍÁØ (°æÈñ´ëÇб³), Á¤±â¼® (ÇѾç´ëÇб³), Á¤Áø±Õ (ÀüºÏ´ëÇб³),
Á¶°æ·Ï (ÃæºÏ´ëÇб³), Ãֱ⿵ (¼­¿ï´ëÇб³), ÃÖÁظ² (°æºÏ´ëÇб³), ÇÑÅÂÈñ (¼º±Õ°ü´ëÇб³),
Ȳ¸íÀº (»ï¼ºÀüÀÚ), ¹éÀ±Èï (¼­¿ï´ëÇб³), ±èÅÂȯ (Çѱ¹Ç×°ø´ëÇб³)

P. Device for Energy (Solar Cell, Power Device, etc.)
ºÐ°úÀ§¿øÀå ¸íÀç¹Î(¿¬¼¼´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±èÀ±±â(»ï¼ºSDI)
ºÐ°úÀ§¿ø ±è¿µÈ¯ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø), ¹Ú¼º±â (LGµð½ºÇ÷¹ÀÌ), Á¤ÁØÈ£ (Çѱ¹±â°è¿¬±¸¿ø),
Á¼ºÈÆ (¼­¿ï»ê¾÷´ëÇб³), ÇÔ¹®È£ (±¤ÁÖ°úÇбâ¼ú¿ø), ±èÇüŹ (È«ÀÍ´ëÇб³), Á¤Çö¼® (¼º±Õ°ü´ëÇб³),
¼ÛÈñÀº (Çѱ¹¿¡³ÊÁö±â¼ú¿¬±¸¿ø), ±è¿ëÅ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)

Q. Metrology, Inspection, and Yield Enhancement
ºÐ°úÀ§¿øÀå ±èÈ£¼·(¼±¹®´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À¯Çü¿ø(SKÇÏÀ̴нº)
ºÐ°úÀ§¿ø ±èÀç»ï (³ª³ë¸ÞÆ®¸¯½ºÄÚ¸®¾Æ¢ß), ±èÁø½Â (ÀüºÏ´ëÇб³), ¹Úº´Ãµ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø),
¹è¿¬È£ (KLA-Tencor), ¾çÁظð (³ª³ëÁ¾ÇÕ±â¼ú¿ø), ¿ìºÀÁÖ (¢ß½ê¹Ì½Ã½ºÄÚ), À̺´È£ (Ultratech),
ÀÓ¼±Á¾ (Çѱ¹±â°è¿¬±¸¿ø), Á¶¿ëÀç (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÇÑÀç¿ø (¿¬¼¼´ëÇб³), ±èÁßÁ¤ (»ï¼ºÀüÀÚ),
ÀÌ»ó±æ (»ï¼ºÀüÀÚ)

R. Semiconductor Software
ºÐ°úÀ§¿øÀå ¹ÝÈ¿°æ (ÀÌÈ­¿©ÀÚ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹é½ÂÀç(´Ü±¹´ëÇб³)
ºÐ°úÀ§¿ø ¿øÀ¯Áý (ÇѾç´ëÇб³), ÃÖÁ¾¹« (´Ü±¹´ëÇб³), ³ë»ïÇõ (È«ÀÍ´ëÇб³), ±èÁø¼ö (¼º±Õ°ü´ëÇб³),
½Åµ¿±º (¼º±Õ°ü´ëÇб³), °­¼ö¿ë (ÇѾç´ëÇб³), ±èÁ¾¹Î (Texas A&M University),
±è¿µ±Õ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), À̵¿Èñ (¼­¿ï½Ã¸³´ëÇб³), ³²ÀÌÇö (SKÅÚ·¹ÄÞ), ÀÌâ°Ç (¼­¿ï´ëÇб³),
Á¶»ó¿¬ (»ï¼ºÀüÀÚ), ÀÓÈ¿ÁØ (LGÀüÀÚ), ÇãÁØ¿µ (ÇѼº´ëÇб³), ¹ÎÈ« (È£¼­´ëÇб³), ±èż® (±¤¿î´ëÇб³),
ÁÖ¿ë¼ö (ÀÌÈ­¿©ÀÚ´ëÇб³), ÀÌÀºÁö (ÃæºÏ´ëÇб³)