A. Interconnect & Package

Interconnect

• Metallization & Low-k Dielectrics
• Thin Film Deposition for Interconnect: ALD, Sputtering, Spin coating etc
• Planarization Technology for Dielectrics and Metal
• Metal Electrode &Transparent Conducting Oxides
• Silicide / Salicide& Contact, Barrier, Plug Materials
• Process Integration, Modeling, Simulation & Reliability for Interconnect
• Passive Component Integration and Characterization
• Interconnect for Display Devices: Inkjet, Roll to Roll, Printing etc
• 3D integration, TSV, Wafer bonding
• New Concept Interconnect (RF, Microwave, Optical etc.)
• Novel Interconnect Materials including CNT, Graphene, Nanowire etc

Package

• Packaging Materials & Processes
• Advanced Packages (Flip chip / CSP/WLP / MCP / SiP / TSV)
• RF / MEMS / Sensor / Solid State Lighting Packaging and Integration
• Actives and Passives Embedding Technologies
• EMI Solution
• Thermal management: Thermal Interface materials, Advanced Cooling, Thermal measurement etc.
• Optoelectronics for packaging: photonic devices, waveguides, optical wiring board etc.
• Packaging for Automotive Electronics: Power devices, Power electronics etc
• Package Design, Reliability, Simulation & Test
• High Density Substrate & SMT
• Printed Electronics for Package
• Emerging Package Technologies
• Interposer & 2.5D/3D integration
• Medical device packaging
• Power packaging
• New concepts, interconnects and processes for high performance packaging

B. Patterning

Lithography	• Optical, EUV, E-Beam, Imprint Lithography • Double Patterning • Simulation and Optical Proximity Correction • Design for Manufacturing • Photoresist and Related Process • Mask Technology • Overlay control • DSA(Directed Self-assembly)
Dry Etching	• Plasma & Surface Reactions • Conductor & Si Etching • Dielectric Etching • Plasma-Induced Damage • Plasma Diagnostics • Modeling and Simulation • Plasma Equipment • Monitoring Systems • New Dry Process & Classification (FDC) • Advanced Process Control (APC)

C. Materials Growth & Characterization

• Bulk Semiconductor Growth (IV, III-V, II-VI Compound Semiconductors)
• Thin Film Epitaxial Growth (IV, IV-IV, III-V, II-VI Compound Semiconductors)
• Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, etc.)
• Selective Epitaxy for Device Applications
• Growth of Nanostructures for Nitride and Oxide Semiconductors
• Growth of Nanohybrid Structures and Applications.
• New Characterization Methods for Materials
• Growth and Characterization of Carbon Related Materials (Graphene, Graphite Oxide, CNT, etc.)

D. Thin Film Process Technology

• Advanced Gate Stack, Channel Process, and Integration Technology
• Novel Thin Film Processes
• Advanced DRAM Capacitor Materials and Devices
• New Memory Materials
• Thin Film Processes for Transistor (TFT), Photovoltaics, Sensors, and Actuators
• Organic Thin Film
• Low Temperature (‹100C) Thin Deposition and Application
• Advanced Thin Film Deposition and Treatment Apparatus for Mass Production

E. Compound Semiconductors

• III-V Electronic and Optoelectronic Devices
• SiC, SiGe, and Other Compound Semiconductor Devices
• HBTs, HEMTs, and MISFETs
• LEDs, LDs, and Photodiodes
• RFICs, MMICs and HICs
• High Frequency and High Power Electronics
• Novel Devices and Materials
• New Process Technologies
• Backside Processing
• Manufacturing and Packaging
• Reliability, ESD, and Quality Issues

F. Silicon Device and Integration Technology

• Device and Process Variations
• Reliability and Novel Test Methodologies of Scaled CMOS
• New Materials for Scaled CMOS (High-k, Metal Gate, Silicides, Channel Materials - III-V, Ge, Graphene)
• New Processes for Scaled CMOS (Junction, Activation, Strain Engineering (CESL, SMT, eSiGe, eSIC)
• Novel Devices for CMOS Applications (Bulk Devices, SOI Devices)
• Three-Dimensional Devices (FinFET, MUGFET)
• Gate Stack Technology for Scaled CMOS
• CMOS Technology for SRAM in High Performance and Low Power Applications
• Analog/RF CMOS Processes and Devices
• High Voltage Devices

G. Device & Process Modeling, Simulation and Reliability

• Process / Device Modeling and Simulation
(Compact Modeling, Particle or Continuum-level Process/Device Simulations, Atomistic Approaches for Growth, Fabrication, and Transport Simulations, etc.)
• Modeling and Simulation for Novel Semiconductor Devices
(FinFETs, Ultra-thin-body MOSFETs, III-V MOSFETs, Tunnel FETs, Spintronic FETs, and Carbon-based FETs, Charge Trap Devices, etc.)
• Device Characterization, Variability and Yield
(Device Model Parameter Extraction, Random Dopant Fluctuation, Random Telegraph Noise, Yield Analysis, etc.)
• Reliabilty
(Hot Carrier Effect, Time Dependent Dielectric Breakdown, Device Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical Overstress (EOS) and Electrostatic Discharge (ESD) effects, etc.)
• emi-classical/Quantum Transport and Simulation of Nano-scale FET devices

H. Display and Imaging Technologies

• Active Matrix Devices
• Liquid Crystal Technology
• Plasma Display
• Light Emitting Displays and Lighting
• Flexible Displays
• Other Display Technologies
• Printable Electronics
• Thin Film Electronics
• Imaging Technologies
• Display and Imaging Device Driving Technology
• Circuits for Display and Imaging Device

I. MEMS & Sensors

• Macro/Meso/Micro/Nano Sensors
• Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors
• Smart/Intelligent/Integrated/Ubiquitos Sensor/Systems
• MEMS and Microsystems
• Bio/Biomedical MEMS
• Micro Fluidics and Lab-on-a-Chip
• Optical and RF MEMS
• Power Microsystems
• Micro/Nano Material and Fabrication

J. Nano-Science & Technology

• Graphene and Related Carbon Nanostructures
• Two-Dimensional Materials beyond Graphene
• Nanophotonic Materials and Devices
• Quantum Dot Photonics and Photovoltaics
• Soft Electronic/Photonic Materials and Devices
• Nanoscale Materials and Systems for Energy Conversion/Storage
• Quantum Transport Phenomena Related to Nanostructures
• Nanofabrication and Self-Assembly for Device Applications
• Spintronics: Materials and Devices
• Theoretical Transport Physics for Nanostructures

K. Memory (Design & Process Technology)

• New Memory Cells / Device Concepts & Innovations
• Memory Process Technology Innovation and Advanced Processes
• Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories
• Emerging Memory Modeling / Design / Process / Device Technologies / Applications Including MRAMs, FeRAMs, PCRAMs, RRAMs, Spin-Torque-Transfer Memories, NEMS, Nano-Crystal, and FinFET, memristors, memristive devices and new 3D Memories
• Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design

L. Analog Design

• Analog Building Blocks
• Data Converters
• Power Circuits
• Display Driver ICs
• Image Sensors & Smart Sensors
• Clock Recovery & Generation
• Analog / Mixed-Signal Design Techniques
• Bio / Biomedical ICs

M. RF Design

• Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers
• Mixers, VCOs, and Frequency Synthesizers
• RF Transceiver ICs
• RF IC Design Techniques
• High-speed Serial Interface Circuits
• Millimeter-Wave ICs
• RF Photonics ICs and Systems
• RF Device Modeling
• Terahertz ICs

N. VLSI CAD

• Hardware/software co-design
• Architecture, logic, physical synthesis
• Simulation/verification
• Deep submicron signal integrity
• Low power design methodology
• High performance design methodology
• Mixed-signal/RF design methodology
• Technology CAD
• Testing, Design for testability (DFT)
• GPU-based implementation of CAD algorithms
• Near threshold voltage design methods
• Other applications of CAD algorithms

O. System LSI Design

• Processor/Multi-Core Architecture
• OS and Compiler for Embedded Systems
• Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
• High-Speed / Low-Power Logic / Circuit
• Circuits and Systems for Communications
- Circuits and Systems for Digital Signal Processing / Visual Signal Processing
- Circuits and Systems for Storages (Memory Controller, eMMC, Solid-State Drive, etc.):
ECC and other Channel Signal Processing Algorithm and Hardware Architecture Multimedia
Systems and Applications
• VLSI Systems and Applications

P. Device for Energy

• Crystalline Silicon Solar Cells and Technologies
• PV Modules and System Components Including Testing and Reliability
• CIGS-II-VI and Related Thin Film Cell
• Amorphous and Nano/Microcrystalline Silicon Based Solar Cells and Related Materials
• III-V Materials and Devices for Concentrator and Space PV Systems
• Photovoltaics with Nanocomposites and Other New Concepts
• PV Architecture and PV systems

Q. Metrology, Inspection, and Yield Enhancement

• Metrology and Inspection Methodologies
• Critical Dimension Metrologies
• Overlay, Registration, and Alignment Metrologies
• Process Control and Characterization
• Quality Assurance and Yield Enhancement
• Defect Detection, Analysis and Control
• Measurement System Modeling and Simulation
• Mask Related Metrology
• LCD / OLED Related Metrology

R. Semiconductor Software

• Software architecture for new semiconductor technology
• Simulation and Emulation techniques for storage design
• Software for Fusion semiconductor
• File system and FTL (Flash Translation Layer)
• Storage Algorithms
• I/O Stack Analysis
• Virtualization for memory and storage
• Low power storage
• Bigdata issues on storage