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Program at a Glance |
Program > Program at a Glance |
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Feb. 24
(Mon.) |
#210 |
#310 |
#606 |
#608 |
HIT |
15:00-18:00 |
Short Course 1 |
Short Course 2 |
Short Course 3 |
Short Course 4 |
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Feb. 25
(Tue.) |
Room A |
Room C |
Room D |
Room E |
Room F |
Room G |
Room H |
Room I |
Room J |
Room K |
Room L |
Room M |
Room N |
#612 |
#401 |
#402 |
#403 |
#404 |
#405 |
#407 |
#408 |
#501 |
#502 |
#503 |
#508- 509 |
Lobby |
HIT |
Á¦ 1°øÇаü (Engineering Building I) |
09:30-11:00 |
|
TC1-A |
TD1-P |
TE1-H |
TF1-L |
TG1-O |
¡¡ |
TJ1-G |
TK1-K |
TL1-J |
Chip
Design
Contest |
Àü½Ã
(Exhi-
bition) |
Atomic
Layer
Depo-
sition
and
Silicides |
Device
for
Energy
I |
Display
and
Imager
Circuit |
¾Æ³¯·Î±×
¹×
È¥¼º
½Å ȸ·Î
¼³°è
1 |
VLSI
System Design
and
Applica-
tions I |
Device Physics
&
Simulation |
New
Memor-
ies
for
Neuro-
morphic
and
Recon-
figurable
Systems |
Graph-
ene & 2D |
11:00-11:10 |
Chip Design Contest Âü°ü (& Break) |
11:10-12:40 |
TC2-A |
TD2-P |
TE2-H |
TF2-N |
TG2-O |
|
TJ2-G |
TK2-K |
TL2-J |
Plating
and
Reliability |
Device
for
Energy
II |
Display
Device |
CAD &
Low
Power |
VLSI
System Design
and
Applica-
tions II |
Device
Simula-
tions/
Charac-
teri-
zation |
3D
Memory
Tech-
niques |
ReRAM |
12:40-13:40 |
Á¡½É (Lunch) |
13:40-14:10 |
Opening Ceremony / HIT Building, Room A (#612, 6F) |
14:10-14:50 |
Plenary Talk I / HIT Building, Room A (#612, 6F) |
14:50-15:30 |
Plenary Talk II / HIT Building, Room A (#612, 6F) |
15:30-15:40 |
Chip Design Contest Âü°ü (& Break) |
15:40-17:10 |
[Engineering Building II]
Rump Session 1(#301, 3F) / Rump Session 2(#302, 3F)
Rump Session 3(#401, 4F) / Rump Session 4(#402, 4F) |
17:10-18:30 |
¡¡ |
[TP1]
Poster 1
A, G, H,
K, L, P |
¡¡ |
18:30-20:30 |
Á¦21ȸ Çѱ¹ ¹ÝµµÃ¼Çмú´ëȸ ȯ¿µ ¹× ¡°Ã¢Á¶°æÁ¦ ½ÇÇö À§ÇÑ À¶ÇչݵµÃ¼¡±¼±Æ÷½Ä |
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Feb. 26
(Wed.) |
Room A |
Room C |
Room D |
Room E |
Room F |
Room G |
Room H |
Room I |
Room J |
Room K |
Room L |
Room M |
Room N |
#612 |
#401 |
#402 |
#403 |
#404 |
#405 |
#407 |
#408 |
#501 |
#502 |
#503 |
#508- 509 |
Lobby |
HIT |
Á¦ 1°øÇаü (Engineering Building I) |
09:30-10:50 |
Á¦7Â÷ Interna-
tional
NVM Sympo-
sium |
¡¡ |
»ê±âÆò
¹ÝµµÃ¼
°ü·Ã
»ç¾÷ ¼º°ú
¹ßǥȸ |
[WP1]
Poster 2
B, C, F,
I, J |
¡¡ |
¡¡ |
Àü½Ã
(Exhi-
bition) |
10:50-12:05 |
WC1-A |
WD1-B |
WE1-D |
WF1-E |
WG1-F |
|
WJ1-G |
WK1-I |
WL1-J |
High
Perfor-
mance
Mobile
Packa-
ging
Techn-
ology |
Patterning |
Thin-
Film
Tran-
sistors |
Com-
pound
Semi-
con-
ductor I |
Emer-
ging
Device
Techn-
ologies |
Thin-
Film
Transi-
stors/
Relia-
bility |
Bio
Sensor |
³ª³ë
±¸Á¶ |
12:05-13:05 |
Á¡½É (Lunch) |
13:05-14:20 |
WC2-A |
WD2-C |
WE2-D |
WF2-E |
WG2-F |
¹Ì·¡ºÎ
Frontier
»ç¾÷¼º°ú
º¸°í |
|
WJ2-M |
WK2-I |
WL2-J |
3D &
2.5D
Packa-
ging
Techn-
ology |
Nitride/
Gra-
phene Growth
and
Applica-
tions |
Memory
Thin-
Film
Tech-
nologies |
Com-
pound
Semi-
con-
ductor
II |
Fin
FETs,
CIS and
Power
Devices |
Wireless
Trans-
cover |
Phy-
sical
Sen-
sors |
³ª³ë
À¶ÇÕ
¼ÒÀÚ |
14:20-14:30 |
ÈÞ½Ä (Break) |
ÈÞ½Ä (Break) |
14:30-15:50 |
¡¡ |
[WP2]
Poster 3
D, E,
M, Q |
|
15:50-17:05 |
WC3-R |
WD3-C |
WE3-D |
WF3-E |
WG3-O |
|
WJ3-N |
WK3-K |
WL3-J |
Soft-
ware
Tech-
nique
for
Persi-
stent
Memory |
Growth
of
Single
Cryst-
alline
Semi-
con-
ductor |
Thin-Film
Process |
Com-
pound Sem-
icon-
ductor
III |
VLSI
System
Design
and
Applica-
tions III |
Memory
&
Architec-
ture |
Resi-
stive Memory
Devices
for
Cross-
Point
Array |
¿¡³ÊÁö |
17:05-17:15 |
ÈÞ½Ä (Break) |
ÈÞ½Ä (Break) |
17:15-18:30 |
WC4-R |
WD4-Q |
¡¡¡¡ |
WF4-L |
¡¡¡¡ |
|
WJ4-N |
WK4-K |
¡¡¡¡ |
Software
Tech-
nique
for
NAND
Flash
Based
Storage |
Metro-
logy
and
Inspec-
tion |
¾Æ³¯·Î±×
¹×
È¥¼º
½Å ȸ·Î
¼³°è 2 |
Simula-
tion &
Testing |
ReRAM Selec-
tors, PCRAM
Model,
and
DRAM
Macro |
|
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WF3-E |
T |
È¿äÀÏ |
C |
Room C |
1 |
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A |
J |
W |
¼ö¿äÀÏ |
D |
Room D |
2 |
µÎ¹ø° |
B |
K |
¡¡ |
E |
Room E |
3 |
¼¼¹ø° |
C |
L |
F |
Room F |
4 |
³×¹ø° |
D |
M |
G |
Room G |
¡¡ |
E |
N |
J |
Room J |
F |
O |
K |
Room K |
G |
P |
L |
Room L |
H |
Q |
¡¡ |
I |
R |
* WF3-E : ¼ö¿äÀÏ Room F¿¡¼ ¼¼¹ø°·Î ÁøÇàµÇ´Â EºÐ°ú ¼¼¼Ç
* WF3-E-2 : ¼ö¿äÀÏ Room F¿¡¼ ¼¼¹ø°·Î ÁøÇàµÇ´Â EºÐ°ú ¼¼¼ÇÀÇ µÎ¹ø° ¹ßÇ¥ |
A |
Interconnect & Package |
J |
Nano-Science & Technology |
B |
Patterning |
K |
Memory (Design &
Process Technology) |
C |
Materials Growth & Characterization |
L |
Analog Design |
D |
Thin Film Process Technology |
M |
RF Design |
E |
Compound Semiconductors |
N |
VLSI CAD |
F |
Silicon Device and Integration Technology |
O |
System LSI Design |
G |
Device & Process Modeling,
Simulation and Reliability |
P |
Device for Energy |
H |
Display and Imaging
Technologies |
Q |
Metrology, Inspection,
and Yield Enhancement |
I |
MEMS & Sensors |
R |
Semiconductor Software |
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