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´ëȸ°³¿ä > Á¶Á÷±â±¸ > ºÐ°úÀ§¿øȸ
A. Interconnect & Package ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌ¿øÁØ (¼¼Á¾´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÀÌ¿õ¼± (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø °û³ëÁ¤ (SK ÇÏÀ̴нº), ±è±¸¼º (°­³²´ëÇб³), ±è¼öÇö (¿µ³²´ëÇб³), ±è½Ã¹ü (¸Å±×³ªÄ¨¹ÝµµÃ¼), ±èÇüÁØ (¿¬¼¼´ëÇб³),
¹Ú¿µ¹è (¾Èµ¿´ëÇб³), ¼ÕÇöö (¿¬¼¼´ëÇб³), ÀÌÅÂÀ± (¿¬¼¼´ëÇб³), ÀÌÇÑÃá (µ¿ºÎÇÏÀÌÅØ), ÀÌÈÄÁ¤ (¼º±Õ°ü´ëÇб³),
Á¤Áö¿µ (¿¥ÄÚÅ×Å©³î·ÎÁö), ÁÖ¿µÃ¢ (¼­¿ï´ëÇб³), ȲÅÂÁÖ (»ï¼ºÀüÀÚ)
B. Patterning ºÐ°ú
ºÐ°úÀ§¿øÀå ¾çÇöÁ¶ (SK ÇÏÀ̴нº)
°øµ¿ºÐ°úÀ§¿øÀå ÀÌ½Â°É (ÀÎÇÏ´ëÇб³)
ºÐ°úÀ§¿ø ±èÇö¿ì (ÇѾç´ëÇб³), ½Å°æ¼· (»ï¼ºÀüÀÚ), ¾ÈÁøÈ£ (ÇѾç´ëÇб³), ¾Èâ³² (ASML), ¿À¿ëÈ£ (¿ø±¤´ëÇб³),
À¯¿øÁ¾ (¼º±Õ°ü´ëÇб³), Á¤Áø±â (SK ÇÏÀ̴нº), ȲÂù (»ï¼ºÀüÀÚ)
C. Material Growth & Characterization ºÐ°ú
ºÐ°úÀ§¿øÀå ±è¼ºº¹ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁø¼· (ÇѾç´ëÇб³)
ºÐ°úÀ§¿ø ±Ç¼ø¿ë (UNIST), ±è¹®´ö (Ãæ³²´ëÇб³), ¹ÚÀÏ±Ô (¿µ³²´ëÇб³), ¼ÛÁ¤ÈÆ (°øÁÖ´ëÇб³), ¼ÛÁøµ¿ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø),
ÀÌ»óÁØ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌÁرâ (Àü³²´ëÇб³), ÀÌö·Î (ÀüºÏ´ëÇб³), Á¶¿ëÈÆ (KAIST)
D. Thin Film Process Technology ºÐ°ú
ºÐ°úÀ§¿øÀå Ȳ±âÇö (»ï¼ºÀüÀÚ)
°øµ¿ºÐ°úÀ§¿øÀå À±¼º¹Î (°æÈñ´ëÇб³)
ºÐ°úÀ§¿ø ±èÇü¼· (¼º±Õ°ü´ëÇб³), ¹Î¿ä¼Á (°Ç±¹´ëÇб³), ¹ÚÁ¤ÈÆ (SK ÇÏÀ̴нº), ¹ÚÅÂÁÖ (ÇѾç´ëÇб³), Àü»óÈÆ (°í·Á´ëÇб³),
Á¤¼±È£ (Çѱ¹È­Çבּ¸¿ø), Á¶¼º¸ñ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Á¶¿µÁø (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ÃÖ¸®³ë (ÀÎÇÏ´ëÇб³),
ÃÖâȯ (ÇѾç´ëÇб³)
E. Compound Semiconductors ºÐ°ú
ºÐ°úÀ§¿øÀå ¹Îº´±Ô (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø)
°øµ¿ºÐ°úÀ§¿øÀå °ûÁؼ· (¼øõ´ëÇб³)
ºÐ°úÀ§¿ø ±èÁ¦¿ø (»ï¼ºÀüÀÚ), ¹®Àç°æ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ½É±Ôȯ (ÀüºÏ´ëÇб³), À±Çü¼· (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø),
ÀÌÁ¤Èñ (°æºÏ´ëÇб³), ÀÓÁ¾¿ø (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ÀåÅÂÈÆ (LG ÀüÀÚ), Â÷È£¿µ (È«ÀÍ´ëÇб³), ¼­Àº°æ (ÀüºÏ´ëÇб³)
F. Silicon Device & Integration Technology ºÐ°ú
ºÐ°úÀ§¿øÀå Ãֿ쿵 (¼­°­´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À̳»ÀÎ (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø ³ëŹ® (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ½Åµ¿¼® (»ï¼ºÀüÀÚ), ¾çÁö¿î (°í·Á´ëÇб³), À̺´ÈÆ (±¤ÁÖ°úÇбâ¼ú¿ø),
ÀÌÁ¾È£ (¼­¿ï´ëÇб³), ÀÌÃæÈ£ (»ï¼ºÀüÀÚ), ÀÌÈñ´ö (Ãæ³²´ëÇб³), Á¤¼º¿õ (SK ÇÏÀ̴нº), Á¶¿ë¼ö (µ¿ºÎÇÏÀÌÅØ)
G. Device & Process Modeling, Simulation and Reliability ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌÀç±Ô (»ï¼ºÀüÀÚ)
°øµ¿ºÐ°úÀ§¿øÀå ½Å¹Îö (KAIST)
ºÐ°úÀ§¿ø ±è´ëȯ (±¹¹Î´ëÇб³), ¹Ú¹®¼ö (»ï¼ºµð½ºÇ÷¹ÀÌ), ¹ÚÂùÇü (±¤¿î´ëÇб³), ¹èÁ¾¿í (LG µð½ºÇ÷¹ÀÌ), ÀÌ»ó±â (µ¿ºÎÇÏÀÌÅØ),
À̼ºÇö (Çѱ¹¿Ü±¹¾î´ëÇб³), ÀÌÁ¤¼ö (Æ÷Ç×°ø°ú´ëÇб³), Á¶Àοí (SK ÇÏÀ̴нº), ÃÖÀçÈÆ (SK ÇÏÀ̴нº)
H. Display and Imaging Technologies ºÐ°ú
ºÐ°úÀ§¿øÀå ¹èº´¼º (È£¼­´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÃÖº´´ö (ÇѾç´ëÇб³)
ºÐ°úÀ§¿ø ±¸º»¿ø (»ï¼ºÁ¾ÇÕ±â¼ú¿ø), ±ÇÀåÇõ (°æÈñ´ëÇб³), ±è¿µ¼® (ÀüÀÚºÎÇ°¿¬±¸¿ø), ±èÀçÈÆ (ÇѾç´ëÇб³),
³ë¿ë¿µ (µ¿±¹´ëÇб³), ¸ð¿¬°ï (»ï¼ºµð½ºÇ÷¹ÀÌ), ¹®Ã¶Èñ (È£¼­´ëÇб³), ¹Ú»ó½Ä (¼¼Á¾´ëÇб³),
¹Ú»óÈñ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ¼ÛÁ¤±Ù (µ¿¾Æ´ëÇб³), À̽¿ì (°æÈñ´ëÇб³), ÀÌ¿ìÀç (»ï¼ºµð½ºÇ÷¹ÀÌ),
Àç°æ (ÀÎÇÏ´ëÇб³), Á¶Á¤´ë (Çѱ¹±â°è¿¬±¸¿ø), Áøº´µÎ (´Ü±¹´ëÇб³), È«¹®Ç¥ (°í·Á´ëÇб³),
È«¿Ï½Ä (¼­¿ï½Ã¸³´ëÇб³), È«¿ëÅà (¼­¿ï´ëÇб³)
I. MEMS & Sensors ºÐ°ú
ºÐ°úÀ§¿øÀå ¹®¼º¿í (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø)
°øµ¿ºÐ°úÀ§¿øÀå ±è»óÀÎ (¾ÆÁÖ´ëÇб³)
ºÐ°úÀ§¿ø °­°üÇü (Æ÷Ç×°ø°ú´ëÇб³), °ø¼ºÈ£ (°æºÏ´ëÇб³), ±Ç¼ºÈÆ (¼­¿ï´ëÇб³), ±Ç¼øÈ« (Áß¾Ó´ëÇб³), ±èµ¿Çö (¿¬¼¼´ëÇб³),
±è¿µ¹Î (È«ÀÍ´ëÇб³), ³²È¿Áø ((LG ÀüÀÚ±â¼ú¿ø), ·ùÇÑ¿­ (ÀÎÇÏ´ëÇб³), ½ÅÇüÀç (»ï¼ºÀüÀÚ), À¯°æ½Ä (KAIST),
ÀÌ»ó¿ì (¿¬¼¼´ëÇб³), Àå¿øÀÍ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), Á¶¼ºº¸ (°¡Ãµ´ëÇб³), ÁÖº´±Ç (°í·Á´ëÇб³)
J. Nano-Science & Technology ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌŹÈñ (¼­¿ï´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¶°æ»ó (»ï¼ºÁ¾ÇÕ±â¼ú¿ø)
ºÐ°úÀ§¿ø °­±â¼® (¼­¿ï´ëÇб³), ±è ¿õ (°í·Á´ëÇб³), ±è»ó¿í (KAIST), ¹Ú¿øÀÏ (ÇѾç´ëÇб³), ¹Úö¹Î (¿¬¼¼´ëÇб³),
¾ÈÁ¾Çö (¿¬¼¼´ëÇб³), ÀÌ ¿ì (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ÀÌ°ÇÀç (KAIST), ÀÌÅ¿ì (Æ÷Ç×°ø°ú´ëÇб³),
ÀÌÇö¿ì (Æ÷Ç×°ø°ú´ëÇб³), Á¶¹®È£ (¿¬¼¼´ëÇб³), ÇÑ»ó¼ö (¿¡ÀÌÄ¡¿£ÇÇ ±¹Á¦Æ¯Çã¹ý·ü»ç¹«¼Ò)
K. Memory (Design & Process Technology) ºÐ°ú
ºÐ°úÀ§¿øÀå ¹Î°æ½Ä (±¹¹Î´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå Á¶¿ì¿µ (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø °­¸í°ï (»ï¼ºÀüÀÚ), °ø¹è¼± (¼º±Õ°ü´ëÇб³), °ûµ¿È­ (»ï¼ºÀüÀÚ), ±è¼ö±æ (SK ÇÏÀ̴нº), ±è¿µÈñ (â¿ø´ëÇб³),
±è¿ë±â (SK ÇÏÀ̴нº), ±èÅý (SK ÇÏÀ̴нº), ¹é½ÂÀç (ÇÑ°æ´ëÇб³), ÀÌÀ籸 (»ï¼ºÀüÀÚ), Á¶¼ºÀÍ (ÀüºÏ´ëÇб³),
ÃÖ¿µµ· (»ï¼ºÀüÀÚ), È« ±Ç (SK ÇÏÀ̴нº), È«»óÈÆ (°æÈñ´ëÇб³)
L. Analog Design ºÐ°ú
ºÐ°úÀ§¿øÀå À¯Ã¢½Ä (ÇѾç´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹Úº´ÇÏ (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø °íÁø¼® (µ¿ºÎÇÏÀÌÅØ), ±è¼öȯ (¼­¿ï´ëÇб³), ±è½ÃÈ£ (¿¬¼¼´ëÇб³), ³ëÁ¤Áø (ÇѾç´ëÇб³), ·ù½ÂŹ (KAIST),
¹® ¿ë (¼þ½Ç´ëÇб³), ¹Ú¿ëÀÎ (µ¿ºÎÇÏÀÌÅØ), ¹é±¤Çö (Áß¾Ó´ëÇб³), ¼Û¹Î±Ô (µ¿±¹´ëÇб³), ½ÉÀçÀ± (Æ÷Ç×°ø°ú´ëÇб³),
¾È±æÃÊ (¼­°­´ëÇб³), À±±¤¼· (ÀÎÇÏ´ëÇб³), À̽ÂÈÆ (¼­°­´ëÇб³), ÀÌÀ±½Ä (ÀüÀÚºÎÇ°¿¬±¸¿ø), ÀÎÇØÁ¤ (ÇѾç´ëÇб³),
ÀÓ½ÅÀÏ (¼­°æ´ëÇб³), ÃÖÁßÈ£ (¼­¿ï½Ã¸³´ëÇб³), ÇÑ°ÇÈñ (¿¬¼¼´ëÇб³), È«±¹Å (LG ÀüÀÚ)
M. RF Design ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌ°­À± (¼º±Õ°ü´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁعè ((ÁÖ)¾Æ³ªÆнº)
ºÐ°úÀ§¿ø ±è¿µÁø (Çѱ¹Ç×°ø´ëÇб³), ±èÁøÅ (°Ç±¹´ëÇб³), ±èõ¼ö (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ±èÅ¿í (¿¬¼¼´ëÇб³),
³²Àϱ¸ (ºÎ»ê´ëÇб³), ¹Îº´¿í (¿¬¼¼´ëÇб³), ¹éµ¿Çö (Áß¾Ó´ëÇб³), ½ÅÇöö (±¤¿î´ëÇб³), ¿Õ¼ºÈ£ (·¹À̵ð¿ÀÆÞ½º(ÁÖ)),
À̹ÎÀç (±¤ÁÖ°úÇбâ¼ú¿ø), ÀÌÀ缺 (°í·Á´ëÇб³), ÀÌÁ¾¿í (°æÈñ´ëÇб³), Á¶¼ºÈ¯ (KAIST)
N. VLSI CAD ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌÁ¾Àº (UNIST)
°øµ¿ºÐ°úÀ§¿øÀå À¯½ÂÁÖ (Æ÷Ç×°ø°ú´ëÇб³)
ºÐ°úÀ§¿ø °­¿ë¼® (LG ÀüÀÚ), ±èÅÂȯ (¼­¿ï´ëÇб³), À±¼º·Î (¼­¿ï´ëÇб³), ½Å¿µ¼ö (KAIST), Àå·¡ÇÐ (¼­¿ï´ëÇб³),
Á¤ÀÇ¿µ (¿¬¼¼´ëÇб³), ÃÖÁ¤¿¬ (»ï¼ºÀüÀÚ), ±èÀ±Áø (¼÷¸í¿©ÀÚ´ëÇб³)
O. System LSI Design ºÐ°ú
ºÐ°úÀ§¿øÀå ÀÌÇÑÈ£ (ÀÎÇÏ´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ¹ÚÁ¾¼± (°í·Á´ëÇб³)
ºÐ°úÀ§¿ø °øÁØÁø (»ï¼ºÀüÀÚ), ±è¼±±â (»ï¼ºµð½ºÇ÷¹ÀÌ), ±èÁöÈÆ (Ãæ³²´ëÇб³), ±èÁø»ó (°æÈñ´ëÇб³), ±èÅÂÂù (»ï¼ºÀüÀÚ),
À̱¤¿± (¼­°æ´ëÇб³), ÀÌÀçÁø (¼­¿ï´ëÇб³), ÀÌÁ¾¿­ (ÀüºÏ´ëÇб³), ÀÌÁø¾ð (»ï¼ºÀüÀÚ),
ÀÌÂùÈ£ (¼þ½Ç´ëÇб³), ÀÌäÀº (ÀÎÇÏ´ëÇб³), ÀåÀÍÁØ (°æÈñ´ëÇб³), Á¤±â¼® (ÇѾç´ëÇб³), Á¤Áø±Õ (ÀüºÏ´ëÇб³),
Á¶°æ·Ï (ÃæºÏ´ëÇб³), Ãֱ⿵ (¼­¿ï´ëÇб³), ÃÖÁ¤È¯ (»ï¼ºÀüÀÚ), ÃÖÁظ² (°æºÏ´ëÇб³), ÇÑÅÂÈñ (¼º±Õ°ü´ëÇб³),
Ȳ¸íÀº (»ï¼ºÀüÀÚ)
P. Device for Energy (Solar Cell, Power Device µî) ºÐ°ú
ºÐ°úÀ§¿øÀå ¸íÀç¹Î (¿¬¼¼´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ±èÀ±±â (»ï¼ºÀüÀÚ)
ºÐ°úÀ§¿ø ±è´ö±â (¼¼Á¾´ëÇб³), ±è¿µÈ¯ (Çѱ¹°úÇбâ¼ú¿¬±¸¿ø), ±è Á¤ (¼¼Á¾´ëÇб³) ¹Ú¼º±â (LG µð½ºÇ÷¹ÀÌ),
À¯ÀÎ±Ô (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ÀÌâÈñ (¼­¿ï´ëÇб³), Á¤ÁØÈ£ (Çѱ¹±â°è¿¬±¸¿ø), Á¼ºÈÆ (¼­¿ï»ê¾÷´ëÇб³),
ÇÔ¹®È£ (±¤ÁÖ°úÇбâ¼ú¿ø)
Q. Metrology, Inspection, and Yield Enhancement ºÐ°ú
ºÐ°úÀ§¿øÀå ±èÈ£¼· (¼±¹®´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå À¯Çü¿ø (SK ÇÏÀ̴нº)
ºÐ°úÀ§¿ø ±èÀç»ï (Nanometrics), ±èÁø½Â (ÀüºÏ´ëÇб³), ¹Úº´Ãµ (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), ¹è¿¬È£ (KLA-Tencor),
¾çÁظð (³ª³ëÁ¾ÇÕÆÕ¼¾ÅÍ), ¿ìºÀÁÖ (½ê¹Ì½Ã½ºÄÚ), À̺´È£ (»ï¼ºÀüÀÚ), ÀÓ¼±Á¾ (Çѱ¹±â°è¿¬±¸¿ø),
Àå¿ø±Ô (LG µð½ºÇ÷¹ÀÌ), Á¶¿ëÀç (Çѱ¹Ç¥ÁØ°úÇבּ¸¿ø), Â÷º´Ã¶ (»ï¼ºÀüÀÚ), ÇÑÀç¿ø (¿¬¼¼´ëÇб³)
R. Semiconductor Software ºÐ°ú
ºÐ°úÀ§¿øÀå ¿øÀ¯Áý (ÇѾç´ëÇб³)
°øµ¿ºÐ°úÀ§¿øÀå ÃÖÁ¾¹« (´Ü±¹´ëÇб³)
ºÐ°úÀ§¿ø °­¼ö¿ë (ÇѾç´ëÇб³), ±è¿µ±Õ (Çѱ¹ÀüÀÚÅë½Å¿¬±¸¿ø), ±èÁ¾¹Î (Texas A&M), ±èÁø¼ö (¼º±Õ°ü´ëÇб³),
³²ÀÌÇö (SK ÅÚ·¹ÄÞ), ³ë»ïÇõ (È«ÀÍ´ëÇб³), ¹ÝÈ¿°æ (ÀÌÈ­¿©ÀÚ´ëÇб³), ¹é½ÂÀç (University of Plttsburgh, USA),
½Åµ¿±º (¼º±Õ°ü´ëÇб³), À̵¿Èñ (¼­¿ï½Ã¸³´ëÇб³), ÀÌâ°Ç (¼­¿ï´ëÇб³), Á¶»ó¿¬ (»ï¼ºÀüÀÚ)