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³í¹®Á¦Ãâ > ¸ðÁýºÐ¾ß |
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InterconnectºÐ¾ß |
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• Metallization & Low-k Dielectrics
• Thin Film Deposition for Interconnect: ALD, Sputtering, Spin coating etc
• Planarization Technology for Dielectrics and Metal
• Metal Electrode &Transparent Conducting Oxides
• Silicide / Salicide& Contact, Barrier, Plug Materials
• Process Integration, Modeling, Simulation & Reliability for Interconnect
• Passive Component Integration and Characterization
• Interconnect for Display Devices: Inkjet, Roll to Roll, Printing etc
• 3D integration, TSV, Wafer bonding
• New Concept Interconnect (RF, Microwave, Optical etc.)
• Novel Interconnect Materials including CNT, Graphene, Nanowire etc |
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PackageºÐ¾ß |
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• Packaging Materials & Processes
• Advanced Packages (Flip chip / CSP/WLP / MCP / SiP / TSV)
• RF / MEMS / Sensor / Solid State Lighting Packaging and Integration
• Actives and Passives Embedding Technologies
• EMI Solution
• Thermal management: Thermal Interface materials, Advanced Cooling, Thermal measurement etc.
• Optoelectronics for packaging: photonic devices, waveguides, optical wiring board etc
• Packaging for Automotive Electronics: Power devices, Power electronics etc
• Package Design, Reliability, Simulation & Test
• High Density Substrate & SMT
• Printed Electronics for Package
• Emerging Package Technologies
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Lithography ºÐ¾ß |
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• Optical, EUV, E-Beam, Imprint Lithography
• Double Patterning
• Simulation and Optical Proximity Correction
• Design for Manufacturing
• Photoresist and Related Process
• Mask Technology
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Dry Etching ºÐ¾ß |
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• Plasma & Surface Reactions
• Conductor & Si Etching
• Dielectric Etching
• Plasma-Induced Damage
• Plasma Diagnostics
• Modeling and Simulation
• Plasma Equipment
• Monitoring Systems
• New Dry Process & Classification (FDC)
• Advanced Process Control (APC)
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• Bulk Semiconductor Growth (IV, III-V, II-VI Compound)
• Thin Film Epitaxial Growth (IV, IV-IV, III-V, II-VI Compound)
• Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, etc.)
• Characterization of Epitaxial Films and Compound Semiconductors
• Selective Epitaxy for Device Applications
• Nitride and Oxide Semiconductors
• Growth and Characterization of Carbon Realted Materials
(Graphene, Graphite Oxide, CNT, etc.)
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• Advanced Gate Stack and Channel Process and Integration Technology
• Novel Thin Film Processes
• Advanced DRAM Capacitor Materials and Devices
• New Memory Materials
• Thin Film Processes for Transistor (TFT), Photovoltaics, Sensors, and Actuators
• Organic Thin Film
• Low Temperature (‹100C) Thin Deposition and Application
• Advanced Thin Film Deposition and Treatment Apparatus for Mass Production
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• III-V Electronic and Optoelectronic Devices
• SiC, SiGe, and Other Compound Semiconductor Devices
• HBTs, HEMTs, and MISFETs
• LEDs, LDs, and Photodiodes
• RFICs, MMICs and HICs
• High Frequency and High Power Electronics
• Novel Devices and Materials
• New Process Technologies
• Backside Processing
• Manufacturing and Packaging
• Reliability, ESD, and Quality Issues
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• Device and Process Variations
• Reliability and Novel Test Methodologies of Scaled CMOS
• New Materials for Scaled CMOS
(High-k, Metal Gate, Silicides, Channel Materials - III-V, Ge, Graphene)
• New Processes for Scaled CMOS
(Junction, Activation, Strain Engineering (CESL, SMT, eSiGe, eSIC)
• Novel Devices for CMOS Applications (Bulk Devices, SOI Devices)
• Non Planar Devices (FinFET, MUGFET)
• Gate Stack Technology for Scaled CMOS
• CMOS Technology for SRAM in High Performance and Low Power Applications
• Analog/RF CMOS Processes and Devices
• High Voltage Devices
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• Process / Device Modeling and Simulation
• Device Characterization, Reliability and Yield Device Characterization,
Reliability and Yield (Hot Carrier Effect, Bias-Temperature Instability,
Time Dependent Dielectric Breakdown, Device Degradation, Yield Analysis, etc.) |
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• Active Matrix Devices
• Liquid Crystal Technology
• Plasma Display
• Light Emitting Displays
• Flexible Displays
• Other Display Technologies
• Printable Electronics
• Thin Film Electronics
• Imaging Technologies
• Display and Imaging Device Driving Technology
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• Macro/Meso/Micro/Nano Sensors
• Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors
• Smart/Intelligent/Integrated/Ubiquitos Sensor/Systems
• MEMS and Microsystems
• Bio/Biomedical MEMS
• Micro Fluidics and Lab-on-a-Chip
• Optical and RF MEMS
• Power Microsystems
• Micro/Nano Material and Fabrication
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• Graphene and Related Carbon Nanostructures: Syntheses and Devices
• Group IV Nanophotonic Materials and Devices
• Two-Dimensional Materials beyond Graphene
• Soft Electronic Materials and Devices
• Quantum Dot Photonics and Photovoltaics
• Nanoscale Energy Conversion Materials and Systems
• Quantum Transport Phenomena Related to Nanostructures
• Directed Self-Assembly for Nanodevice Archetecture
• Spintronics: Materials and Devices
• Modeling and Simulation of Nanodevices |
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• New Memory Cells / Device Concepts & Innovations
• Memory Process Technology Innovation and Advanced Processes
• Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems including New Generation ROMs and Embedded Memories
• Emerging Memory Modeling / Design / Process / Device Technologies / Applications including MRAMs, FeRAMs, PCMa, RRAMs (Resistance Change RAM), Spin-Torque-Transfer Memories, NEMS Based, Nano-Crystal, FinFET, memristors, memristive devices and 3D Memories
• Memory andSolid-State Disk (SSD) Test, yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design
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• Analog Building Blocks
• Data Converters
• Power Circuits
• Display Driver ICs
• Image Sensors & Smart Sensors
• Clock Recovery & Generation
• Analog / Mixed-Signal Design Techniques
• Bio / Biomedical ICs
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• Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers
• Mixers, VCOs, and Frequency Synthesizers
• RF Transceiver ICs
• RF IC Design Techniques
• High-speed Serial Interface Circuits
• Millimeter-Wave ICs
• RF Photonics ICs and Systems
• RF Device Modeling
• Terahertz ICs
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• Hardware/Software Co-Design
• Architecture, Logic, Physical Synthesis
• Simulation/Verification
• Deep Submicron Signal Integrity
• Low Power Design Methodology
• High Performance Design Methodology
• Mixed-Signal/RF Design Methodology
• Technology CAD
• Testing, Design for Testability
• GPU-based implementation of CAD algorithms
• Near threshold voltage design methods
• GPU-based implementation of CAD algorithms
• Near threshold voltage design methods
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• Processor/Multi-Core Architecture
• OS and Compiler for Embedded Systems
• Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
• High speed / Low Power Logic / Circuit
• Circuits and Systems for Communications / Storages (Memory Controller, eMMC, Solid-State Drive, etc.): ECC and other Channel Signal Processing Algorithm and Hardware Architecture
• Circuits and Systems for Digital Signal Processing / Multimedia Signal Processing
• VLSI Systems and Applications
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• Crystalline Silicon Solar Cells and Technologies
• PV Modules and System Components Including Testing and Reliability
• CIGS-II-VI and Related Thin Film Cell
• Amorphous and Nano/Microcrystalline Silicon Based Solar Cells and Related Materials
• III-V Materials and Devices for Concentrator and Space PV Systems
• Photovoltaics with Nanocomposites and Other New Concepts
• PV Architecture and PV systems
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• Metrology and Inspection Methodologies
• Critical Dimension Metrologies
• Overlay, Registration, and Alignment Metrologies
• Process Control and Characterization
• Quality Assurance and Yield Enhancement
• Defect Detection, Analysis and Control
• Measurement System Modeling and Simulation
• Mask Related Metrology
• LCD / OLED Related Metrology
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