제20회 한국반도체학술대회(KCS 2013)::The 20th Korean Conference on Semiconductors::


	Interconnect분야
	• Metallization & Low-k Dielectrics • Thin Film Deposition for Interconnect: ALD, Sputtering, Spin coating etc • Planarization Technology for Dielectrics and Metal • Metal Electrode &Transparent Conducting Oxides • Silicide / Salicide& Contact, Barrier, Plug Materials • Process Integration, Modeling, Simulation & Reliability for Interconnect • Passive Component Integration and Characterization • Interconnect for Display Devices: Inkjet, Roll to Roll, Printing etc • 3D integration, TSV, Wafer bonding • New Concept Interconnect (RF, Microwave, Optical etc.) • Novel Interconnect Materials including CNT, Graphene, Nanowire etc
	Package분야
	• Packaging Materials & Processes • Advanced Packages (Flip chip / CSP/WLP / MCP / SiP / TSV) • RF / MEMS / Sensor / Solid State Lighting Packaging and Integration • Actives and Passives Embedding Technologies • EMI Solution • Thermal management: Thermal Interface materials, Advanced Cooling, Thermal measurement etc. • Optoelectronics for packaging: photonic devices, waveguides, optical wiring board etc • Packaging for Automotive Electronics: Power devices, Power electronics etc • Package Design, Reliability, Simulation & Test • High Density Substrate & SMT • Printed Electronics for Package • Emerging Package Technologies


	Lithography 분야
	• Optical, EUV, E-Beam, Imprint Lithography • Double Patterning • Simulation and Optical Proximity Correction • Design for Manufacturing • Photoresist and Related Process • Mask Technology
	Dry Etching 분야
	• Plasma & Surface Reactions • Conductor & Si Etching • Dielectric Etching • Plasma-Induced Damage • Plasma Diagnostics • Modeling and Simulation • Plasma Equipment • Monitoring Systems • New Dry Process & Classification (FDC) • Advanced Process Control (APC)

• Bulk Semiconductor Growth (IV, III-V, II-VI Compound)
• Thin Film Epitaxial Growth (IV, IV-IV, III-V, II-VI Compound)
• Epitaxy and Characterization of Si-based Materials (Si, SiGe, SiC, etc.)
• Characterization of Epitaxial Films and Compound Semiconductors
• Selective Epitaxy for Device Applications
• Nitride and Oxide Semiconductors
• Growth and Characterization of Carbon Realted Materials
(Graphene, Graphite Oxide, CNT, etc.)

• Advanced Gate Stack and Channel Process and Integration Technology
• Novel Thin Film Processes
• Advanced DRAM Capacitor Materials and Devices
• New Memory Materials
• Thin Film Processes for Transistor (TFT), Photovoltaics, Sensors, and Actuators
• Organic Thin Film
• Low Temperature (‹100C) Thin Deposition and Application
• Advanced Thin Film Deposition and Treatment Apparatus for Mass Production


	• III-V Electronic and Optoelectronic Devices • SiC, SiGe, and Other Compound Semiconductor Devices • HBTs, HEMTs, and MISFETs • LEDs, LDs, and Photodiodes • RFICs, MMICs and HICs • High Frequency and High Power Electronics • Novel Devices and Materials • New Process Technologies • Backside Processing • Manufacturing and Packaging • Reliability, ESD, and Quality Issues

• Device and Process Variations
• Reliability and Novel Test Methodologies of Scaled CMOS
• New Materials for Scaled CMOS
(High-k, Metal Gate, Silicides, Channel Materials - III-V, Ge, Graphene)
• New Processes for Scaled CMOS
(Junction, Activation, Strain Engineering (CESL, SMT, eSiGe, eSIC)
• Novel Devices for CMOS Applications (Bulk Devices, SOI Devices)
• Non Planar Devices (FinFET, MUGFET)
• Gate Stack Technology for Scaled CMOS
• CMOS Technology for SRAM in High Performance and Low Power Applications
• Analog/RF CMOS Processes and Devices
• High Voltage Devices


	• Process / Device Modeling and Simulation • Device Characterization, Reliability and Yield Device Characterization, Reliability and Yield (Hot Carrier Effect, Bias-Temperature Instability, Time Dependent Dielectric Breakdown, Device Degradation, Yield Analysis, etc.)


	• Active Matrix Devices • Liquid Crystal Technology • Plasma Display • Light Emitting Displays • Flexible Displays • Other Display Technologies • Printable Electronics • Thin Film Electronics • Imaging Technologies • Display and Imaging Device Driving Technology


	• Macro/Meso/Micro/Nano Sensors • Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors • Smart/Intelligent/Integrated/Ubiquitos Sensor/Systems • MEMS and Microsystems • Bio/Biomedical MEMS • Micro Fluidics and Lab-on-a-Chip • Optical and RF MEMS • Power Microsystems • Micro/Nano Material and Fabrication

• Graphene and Related Carbon Nanostructures: Syntheses and Devices
• Group IV Nanophotonic Materials and Devices
• Two-Dimensional Materials beyond Graphene
• Soft Electronic Materials and Devices
• Quantum Dot Photonics and Photovoltaics
• Nanoscale Energy Conversion Materials and Systems
• Quantum Transport Phenomena Related to Nanostructures
• Directed Self-Assembly for Nanodevice Archetecture
• Spintronics: Materials and Devices
• Modeling and Simulation of Nanodevices

• New Memory Cells / Device Concepts & Innovations
• Memory Process Technology Innovation and Advanced Processes
• Circuits / Architectures / Design Methodologies / Process Technologies for DRAMs, SRAMs, Nonvolatile Memories,
CAMs, Cache Systems including New Generation ROMs and Embedded Memories
• Emerging Memory Modeling / Design / Process / Device Technologies / Applications including MRAMs, FeRAMs,
PCMa, RRAMs (Resistance Change RAM), Spin-Torque-Transfer Memories, NEMS Based, Nano-Crystal, FinFET,
memristors, memristive devices and 3D Memories
• Memory andSolid-State Disk (SSD) Test, yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and
Statistical Design


	• Analog Building Blocks • Data Converters • Power Circuits • Display Driver ICs • Image Sensors & Smart Sensors • Clock Recovery & Generation • Analog / Mixed-Signal Design Techniques • Bio / Biomedical ICs


	• Low Noise Amplifiers, Driver Amplifiers, Power Amplifiers • Mixers, VCOs, and Frequency Synthesizers • RF Transceiver ICs • RF IC Design Techniques • High-speed Serial Interface Circuits • Millimeter-Wave ICs • RF Photonics ICs and Systems • RF Device Modeling • Terahertz ICs

• Hardware/Software Co-Design
• Architecture, Logic, Physical Synthesis
• Simulation/Verification
• Deep Submicron Signal Integrity
• Low Power Design Methodology
• High Performance Design Methodology
• Mixed-Signal/RF Design Methodology
• Technology CAD
• Testing, Design for Testability
• GPU-based implementation of CAD algorithms
• Near threshold voltage design methods
• GPU-based implementation of CAD algorithms
• Near threshold voltage design methods

• Processor/Multi-Core Architecture
• OS and Compiler for Embedded Systems
• Memory Hierarchy, IO, and On-Chip Communication Architecture and Modeling
• High speed / Low Power Logic / Circuit
• Circuits and Systems for Communications / Storages (Memory Controller, eMMC, Solid-State Drive, etc.): ECC and
other Channel Signal Processing Algorithm and Hardware Architecture
• Circuits and Systems for Digital Signal Processing / Multimedia Signal Processing
• VLSI Systems and Applications

• Crystalline Silicon Solar Cells and Technologies
• PV Modules and System Components Including Testing and Reliability
• CIGS-II-VI and Related Thin Film Cell
• Amorphous and Nano/Microcrystalline Silicon Based Solar Cells and Related Materials
• III-V Materials and Devices for Concentrator and Space PV Systems
• Photovoltaics with Nanocomposites and Other New Concepts
• PV Architecture and PV systems


	• Metrology and Inspection Methodologies • Critical Dimension Metrologies • Overlay, Registration, and Alignment Metrologies • Process Control and Characterization • Quality Assurance and Yield Enhancement • Defect Detection, Analysis and Control • Measurement System Modeling and Simulation • Mask Related Metrology • LCD / OLED Related Metrology