Final Program
2월 13일 (월)
| 2월 13일(월) | Room A | Room B | Room C |
| 에메랄드 (2층) | 토파즈 (2층) | 사파이어 (2층) | |
| 14:00-18:00 | [Short Course 1] Optical Technologies for Metrology and Inspection |
[Short Course 2] 2D 반도체소재의 특성 및 응용 |
[Short Course 3] Neuromorphic 소자 및 활용 |
2월 14일(화)
| 2월 14일(화) | Room A | Room B | Room C | Room D | Room E | Room F | Room G | Room H | Room I | ||
| 2층 | 3층 | ||||||||||
| 에메랄드 | 토파즈 | 사파이어 | 크리스탈 | 루비 | 제이드 | 코럴 | 다이아몬드1 | 다이아몬드2 | 로비 | ||
| 08:30-10:00 | [TA1-D] | [TB1-K] | [TC1-G] | [TD1-S] | [TE1-F] | [TG1-J] | 전시 | Chip Design Contest | |||
| Hybrid Oxide Thin Films | Unconventional Approaches in Resistance Switching Memories | Device Physics and Character -ization 1 |
Chip Design Contest | Advanced CMOS Devices I | Graphene base Nanofabrications (08:30-10:30) |
||||||
| 10:00-10:10 | 휴식(&커피, 다과) | ||||||||||
| 10:10-11:40 | [TA2-D] | [TB2-K] | [TC2-G] | [TD2-E] | [TE2-F] | [TG2-J] | |||||
| Emerging Thin Film Technology | Dielectric, Ferromagnetic, and Phase Change Materials for Memory Application | Reliability Analysis | WBG High Frequency Device | Advanced CMOS Devices II | Two-Dimensional Materials beyond Graphene (10:40-11:40) |
||||||
| 11:40-13:00 | 점심 [포시즌 / 지하1층] | ||||||||||
| 13:00-14:00 | Plenary Session1 [다이아몬드1 / 3층]: 정은승 부사장 (삼성반도체연구소) "The Present and Future of Semiconductor Technology" |
||||||||||
| 14:00-15:00 | Plenary Session2 [다이아몬드1 / 3층]: Dr. Geoffrey W. Burr (IBM Almaden Research Center, USA) "Neuromorphic Technologies for Next-Generation Cognitive Computing" |
||||||||||
| 15:00-16:00 | [TP1] 포스터세션1 |
CDC 관람시간 (Core Session) |
|||||||||
| 16:00-17:30 | [TA3-D] | [TB3-H] | [TC3-G] | [TD3-E] | [TE3-F] | [TF3-R] | [TG3-J] | ||||
| Oxide Thin Film Transistors | Display and Imaging Technologies | Device Modeling and Simulation 1 | WBG Power Device | Flash and Si Memory Technologies | Semiconductor Software 1 | Two-Dimensional Materials beyond Graphene | |||||
| 18:00-20:00 | 만찬 [다이아몬드1 / 3층] | ||||||||||
| 20:00-22:00 | Rump Session 1 [에메랄드 / 2층] 저전력 인공지능을 위한 뉴로모픽 기술의 전망 Rump Session 2 [토파즈 / 2층] Smart Cars: The Next Growth Engine for the Semiconductor Industry Rump Session 3 [사파이어 / 2층] 반도체 스케일링의 향후 전망과 기술 과제 |
||||||||||
2월 15일(수)
| 2월 15일(수) | Room A | Room B | Room C | Room D | Room E | Room F | Room G | Room H | Room I | |
| 2층 | 3층 | |||||||||
| 에메랄드 | 토파즈 | 사파이어 | 크리스탈 | 루비 | 제이드 | 코럴 | 다이아몬드1 | 다이아몬드2 | 로비 | |
| 08:30-10:00 | [WA1-D] | [WB1-A] | [WC1-G] | [WD1-I] | [WE1-F] | [WF1-B] | [WG1-C] | [WH1-O] | 전시 | |
| Thin Films for Memories and Transistors | Packaging and Design | Device Physics and Character -ization 2 |
Flexible Sensors | Advanced CMOS Processing and Reliability | Plasma and Patterning Processes | Materials Growth & Character -ization I |
VLSI System Design and Applications 1 | |||
| 10:00-10:10 | 휴식 (& 커피, 다과) | |||||||||
| 10:10-11:40 | [WA2-D] | [WB2-A] | [WC2-G] | [WD2-I] | [WE2-F] | [WF2-B] | [WG2-C] | [WH2-O] | ||
| 2D Materials and Devices | Process issues of Interconnect | Device Modeling and Simulation 2 | Bio/Gas/Pressure Sensors | Flash and Si Memory Technologies | Patterning and Lithography | Materials Growth & Character -ization II |
VLSI System Design and Applications 2 | |||
| 11:40-12:40 | 점심 [포시즌 / 지하1층] | |||||||||
| 12:40-14:25 | [WA3-D] | [WB3-K] | [WC3-Q] | [WD3-I] | [WE3-F] | [WF3-R] | [WG3-J] | [WH3-M] | ||
| ALD/CVD Thin Films | Resistance Switching Memories | Metrology and Inspection (I) | FET-based sensors | Advanced CMOS Integrated Circuits | Semiconductor Software 2 | Nanofabrication for Next Generation Device Applications | RF and Wireless System and Components | |||
| 14:25-15:25 | [WP1] 포스터세션2 |
|||||||||
| 15:25-17:10 | [WA4-P] | [WB4-K] | [WC4-Q] | [WD4-E] | [WE4-L] | [WF4-R] | [WG4-J] | [WH4-N] | ||
| Materials and Devices for Energy | Understanding Resistance Switching Phenomena | Metrology and Inspection(II) | WBG Chharacterization Technology | Analog Circuit Design | Semiconductor Software 3 | Nanofabrication for Next Generation Device Applications | Advances in Design Automation and Test | |||
| 포스터세션1 | D,F,G,H,K,S | |
| 포스터세션2 | A,B,C,E,I,J,L,M,N,O,P,Q,R | |
구두발표 세션기호 보는 법
| 요일 | 세션룸 | 세션순서 | 분과 | |||||
| T | 화요일 | A | Room A | 1 | 첫번째 세션 | A | I | Q |
| W | 수요일 | B | Room B | 2 | 두번째 세션 | B | J | R |
| C | Room C | 3 | 세변째 세션 | C | K | S | ||
| D | Room D | 4 | 네번째 세션 | D | L | |||
| E | Room E | E | M | |||||
| F | Room F | F | N | |||||
| G | Room G | G | O | |||||
| H | Room H | H | P | |||||
※ TA1-D: 화요일 Room A에서 첫번째로 진행되는 D분과 세션
※ TA1-D-1: 화요일 Room A에서 첫번째로 진행되는 D분과 세션의 첫번째 발표
| 분과명 | |
| A | Interconnect & Package |
| B | Patterning |
| C | Materials Growth & Characterization |
| D | Thin Film Process Technology |
| E | Compound Semiconductors |
| F | Silicon and Group-IV Devices and Integration Technology |
| G | Device & Process Modeling, Simulation and Reliability |
| H | Display and Imaging Technologies |
| I | MEMS & Sensor Systems |
| J | Nano-Science & Technology |
| K | Memory (Design & Process Technology) |
| L | Analog Design |
| M | RF and Wireless Design |
| N | VLSI CAD |
| O | System LSI Design |
| P | Device for Energy (Solar Cell, Power Device, Battery, etc.) |
| Q | Metrology, Inspection, and Yield Enhancement |
| R | Semiconductor Software |
| S | Chip Design Contest |
